Contact Us
English

MCU & Embedded Processors Sourcing

MT41K64M16TW-107:J

MT41K64M16TW-107:J

The MT41K64M16TW-107:J is a 1 Gb (128 MB) DDR3L SDRAM component from Micron Technology, organized as 64M × 16-bit and rated for DDR3L-1866 (1866 MT/s, PC3-14900). Operating at just 1.35V with full backward compatibility to standard 1.5V DDR3, it delivers up to 3.7 GB/s of peak bandwidth in a single x16 chip — making it the workhorse memory for FPGA configuration buffers, networking line cards, industrial single-board computers, and legacy platform maintenance where DDR3L remains the pragmatic choice.

BMI270

BMI270

The BMI270 is an ultra-low-power 6-axis MEMS inertial measurement unit (IMU) from Bosch Sensortec, combining a 16-bit triaxial accelerometer and a 16-bit triaxial gyroscope in a single 2.5 × 3.0 × 0.8 mm LGA-14 package. Drawing just 685 µA in full 6-axis operation, it is purpose-built for always-on motion sensing in wrist-worn wearables, true wireless earbuds (hearables), AR/VR headsets, and motion-enabled IoT devices. On-chip smart interrupt engines for gesture, context, and activity recognition offload the host processor — extending battery life in space-constrained, energy-sensitive designs.

MT40A512M16TB-062E:R

MT40A512M16TB-062E:R

The MT40A512M16TB-062E:R is an 8 Gb (1 GB) DDR4 SDRAM component from Micron Technology, organized as 512M × 16-bit and rated for DDR4-3200 (3200 MT/s, PC4-25600). Packaged in a compact 96-ball TFBGA, it delivers 12.8 GB/s of peak bandwidth in a dual-chip 32-bit embedded configuration — making it the go-to DRAM choice for ARM-based embedded SoCs (NXP i.MX8, Rockchip RK3568, Xilinx Zynq), networking equipment, and industrial computing platforms. The :R suffix designates tape-and-reel packaging for automated high-volume assembly.

AD9361BBCZ

AD9361BBCZ

The AD9361BBCZ is a high-performance, highly integrated 2×2 RF Agile Transceiver™ from Analog Devices — the industry-standard RF front-end for software-defined radio (SDR), 4G base stations, drone datalinks, and wideband test & measurement systems. Covering 70 MHz to 6 GHz with tunable channel bandwidths from under 200 kHz to 56 MHz, it integrates dual independent receivers, dual transmitters, 12-bit ADCs/DACs, fractional-N frequency synthesizers, and configurable digital filters — all in a single 10 mm × 10 mm 144-ball CSP_BGA package.

W25Q64JVSSIQ

W25Q64JVSSIQ

The W25Q64JVSSIQ is Winbond's 64Mbit (8MB) serial NOR Flash memory from the JV series, delivering high-speed code and data storage for embedded systems. It supports standard SPI, Dual SPI, Quad SPI, QPI (Quad Peripheral Interface), and DTR (Double Transfer Rate) — achieving up to 532 Mbit/s effective throughput in Quad SPI mode at 133 MHz. Organized as 8M × 8 bits with uniform 4KB sectors, it provides fine-grained erase flexibility for applications mixing firmware storage with parameter data. The device is rated for 100,000 program/erase cycles minimum per sector with 20+ years data retention, operates from a single 2.7V–3.6V supply, and is specified over the full -40°C to +85°C industrial temperature range. Packaged in a standard 8-SOIC (208 mil) footprint, it is the most widely adopted NOR Flash chip in the embedded industry — the default external flash on ESP32 modules, the go-to code storage for STM32 and FPGA designs, and a staple in IoT, industrial control, and consumer electronics.

LSM6DS3TR-C

LSM6DS3TR-C

The LSM6DS3TR-C is STMicroelectronics' system-in-package 6-axis inertial measurement unit (IMU), part of the iNEMO family. It integrates a high-performance 3D digital accelerometer (up to ±16g) and a 3D digital gyroscope (up to ±2000 dps) with an embedded temperature sensor, all in a compact LGA-14 package. Designed for entry-level to mid-tier smartphones, portable PC platforms, wearables, and IoT devices, it achieves 0.90 mA in combo high-performance mode while supporting always-on low-power features including a hardware pedometer, tilt detection, free-fall detection, and a programmable finite state machine (FSM) for custom gesture recognition. The 4 KB FIFO buffer decouples sensor sampling from host MCU reads, and dual I²C/SPI interfaces with separate Vdd_IO ensure compatibility across 1.8V and 3.3V logic systems. Widely adopted in the Arduino/maker ecosystem (Adafruit, Arduino Nano 33 IoT, Seeed XIAO nRF52), the LSM6DS3TR-C is the recommended successor to the original LSM6DS3TR with improved power efficiency and noise performance.

LIS3DHTR

LIS3DHTR

The LIS3DHTR from STMicroelectronics is an ultra-low-power, high-performance three-axis linear MEMS accelerometer belonging to the "nano" family. With a user-selectable full scale of ±2g, ±4g, ±8g, or ±16g and 16-bit digital output, it delivers precision motion sensing across a wide dynamic range while consuming as little as 2µA in low-power mode. The device provides both I²C and SPI digital interfaces with an embedded 32-level FIFO buffer, a temperature sensor, and advanced motion-detection features — including free-fall, wake-up, 6D/4D orientation, and single/double-click recognition — enabling sophisticated motion processing without waking the host MCU. Packaged in a tiny 3mm × 3mm × 1mm 16-LGA footprint, it is optimized for battery-powered IoT devices, wearables, gaming controllers, and mobile handsets.

REF200AU

REF200AU

The REF200AU from Texas Instruments is a monolithic precision analog IC that integrates three fundamental building blocks — two independent 100µA current sources and a 1:1 current mirror — onto a single die in an 8-SOIC package. Its defining feature is a completely floating architecture: the device requires no power supply pins, no ground connection, and no external biasing. It operates entirely from the voltage present across its output terminals (2.5V to 40V), making it uniquely suited for two-wire sensor excitation, 4–20mA industrial current-loop transmitters, precision analog biasing, medical instrumentation, and semiconductor test equipment. FET-cascoded output stages deliver high output impedance for stable regulation under varying load conditions, with factory-laser-trimmed ±0.5% initial accuracy and ±25 ppm/°C temperature drift.

TPS82130SILR

TPS82130SILR

The TPS82130SILR is a 3A step-down DC-DC converter MicroSiP module from Texas Instruments that integrates the buck converter IC, power inductor, and compensation network into a single 3.0mm x 2.8mm x 1.5mm package. With 3V to 17V input, 0.9V to 6V adjustable output, 2.5MHz fixed switching frequency, and ultra-low 1.7uA quiescent current, it delivers complete power solutions under 40mm^2 total PCB area. DCS-Control provides fast transient response with seamless PWM-to-PFM transition for high efficiency from full load to standby. Ideal for IoT sensors, wearables, industrial modules, and any space-constrained design where discrete buck converters consume too much board real estate.

ISL99390FRZ-TR5935

ISL99390FRZ-TR5935

The ISL99390FRZ-TR5935 is a Gen2 Smart Power Stage (SPS) DrMOS module from Renesas Electronics, delivering 90A continuous output current per phase. It integrates the high-side driver, low-side driver, and MOSFETs into a single compact PQFN package, with added SMBus/PMBus 1.3 digital telemetry providing real-time current and temperature monitoring. Designed for multi-phase buck converters paired with Renesas ISL68/69xxx digital multiphase controllers, it powers server Vcore rails, GPU VRMs, telecom DC-DC converters, and high-current FPGA/ASIC point-of-load applications — enabling scalable, high-efficiency power delivery from 90A to 900A+ with minimal BOM and PCB footprint.

ICM-42688-P

ICM-42688-P

The ICM-42688-P is TDK InvenSense's flagship 6-axis MEMS IMU, combining a best-in-class 3-axis gyroscope with an ultra-low-noise 3-axis accelerometer in a compact 2.5x3.0x0.91mm LGA-14 package. With a gyroscope Angle Random Walk (ARW) of just 2.8 mdps/rtHz and accelerometer noise density of 70 ug/rtHz, it achieves navigation-grade precision at consumer price points. The 16-bit ADC, selectable gyro ranges up to 2000 dps, SPI up to 24 MHz (and I3C/I2C), 2KB FIFO, and 0.88mA low-noise power consumption make it the go-to IMU for drones, robotics, AR/VR, gimbal stabilization, and high-accuracy industrial motion sensing.

MT41K256M16TW-107:P

MT41K256M16TW-107:P

The MT41K256M16TW-107:P is a 4Gb DDR3L SDRAM from Micron Technology, organized as 256M words x 16 bits with a peak data rate of 1866 MT/s (DDR3-1866). Operating at the low-voltage 1.35V DDR3L standard, it delivers the same 1866 MT/s bandwidth as standard 1.5V DDR3 while consuming approximately 20% less power. The double data rate architecture with 8n prefetch, 8 internal banks, and programmable CAS latency (CL13 at -107 speed) make it ideal for embedded systems, industrial controllers, FPGA processing cards, and networking equipment where high memory bandwidth meets thermal/power constraints. The industry-standard 96-ball FBGA package ensures compatibility across a broad ecosystem of DDR3 memory controllers.

W25Q128JVSIQ

W25Q128JVSIQ

The W25Q128JVSIQ is a 128Mbit (16MB) serial NOR Flash memory from Winbond, the industry's most widely deployed SPI Flash family. Featuring Quad SPI at 133 MHz (up to 532 Mbps effective throughput), dual/quad/QPI modes, 4KB uniform sector architecture, and a minimum 100,000 program/erase cycles with 20-year data retention, it serves as the go-to boot code storage for STM32, ESP32, nRF52, and virtually every MCU ecosystem. The industry-standard 8-pin SOIC 208-mil package ensures drop-in compatibility across millions of existing designs and rapid prototyping with breadboard-friendly footprints.