16-Layer High Density Multilayer PCB Manufacturing for Precision Electronic Systems Superb manufactures high density multilayer PCB including 16 layer PCB, complex stack-up PCB, signal integrity controlled PCB and precision PCB assembly solutions.
Intel H81 Mini-ITX Industrial Control Motherboard PCB 6–8 Layer · DDR3L · Dual GbE · 10× COM · PCIe 16X · LVDS · mSATA/mPCIe · 8× USB · High-Density Layout · Superb Automation
IC Substrate Manufacturer-Bond BGA Package Substrate High-precision IC carrier board with 132 Au wire-bond fingers, 144 solder ball pads, and center die-attach thermal pad — achieving CPK 4.08 on gold finger width.
10-Layer 2.60mm HD Multimedia Main Control PCB 2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board
10-Layer High-Precision Multilayer Main Control PCB 10-layer high-precision multilayer main control PCB: 1.60mm, 4/4 mil, ENIG, high-density BGA. Build-to-print from Gerber files. Full DFM, symmetrical lamination. RFQ