Bluetooth Earphone PCB — 8L 2-Step, ENIG | Superb Automation 8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber
14-Layer 6-Step HDI — High-Voltage Power Transformer Module 14-layer 6-step HDI · 70 μm heavy copper · PTFE+FR4 · 2.5 mm · AC withstand > 2000 V · ENIG · Layer offset < 30 μm · Stacked laser via · Build-to-print from Gerber
Heavy Copper / High-Thermal PCB Fabrication Heavy copper PCB manufacturing — 16 layers · 5 oz inner copper · 3.75 mm · Press-fit ±0.05 mm · Resin plug · Blind via · Build-to-print from Gerber files
Multilayer Backplane PCB — 10G Signal Integrity Simulation 10+ Pairs 10G Signals | System-Level Backplane SI Simulation | Connector Supplier Coordination | Functional Test Passed
Communication Board Signal Integrity Simulation 60,000 Pins | SFP+ · Interlaken · QPI · PCIe3 · DDR4 · DDR3 | TU872SLK-sp | Intel Platform Loss Spec | 1-Month Turnaround
Communication Mainboard PCB — High-Density BGA Fanout Design Lattice CPLD + TI FPGA · 4 Bottom-Plate Connectors · 3× Differential · Mid-Board Cutouts · 10–14 Layers · Superb Automation
Intel H81 Mini-ITX Industrial Control Motherboard PCB 6–8 Layer · DDR3L · Dual GbE · 10× COM · PCIe 16X · LVDS · mSATA/mPCIe · 8× USB · High-Density Layout · Superb Automation
Rigid-Flex / Flex PCB Fabrication Rigid-flex PCB manufacturing — 14 layers · 10 rigid + 4 flex · 2+2 split · 2.2 mm · Panasonic · 3 mil line · Lead-free HASL · Build-to-print from Gerber files
20L Hybrid PCB — PTFE+FR4, Embedded R, Blind | Superb Automation Hybrid PCB manufacturing — PTFE+FR4 · 20 layers · 5.7 mm · 4-step blind via · Blind slot · Embedded resistors · Back drill · Build-to-print from Gerber files
2-Layer High-Frequency Microwave PCB High-frequency microwave PCB on PTFE laminate. 2 layers, 0.127–5.0 mm thickness range, 1 × 3 mm minimum board size. Microwave transmission line width tolerance ± 0.015 mm. Full-board ENIG soft gold plus localized thick gold 2 μm. Planar resistor integration and laser cutting.
18-Layer High-Speed Multilayer PCB — Panasonic M6, 64Gbps, 20:1 Aspect Ratio High-speed digital PCB with 18 layers on Panasonic M6 (R-5775) laminate. 4.0 mm finished thickness, 0.20 mm minimum drill at 20:1 aspect ratio. Double-sided back-drilling with stub < 0.08 mm. Differential impedance control ±7.5% (≤ 50 Ω) and ±5% (> 50 Ω). 64 Gbps NRZ/PAM4 signaling capability.
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.webp "14-Layer 6-Step HDI — High-Voltage Power Transformer Module")
.webp "Rigid-Flex / Flex PCB Fabrication")
