PCB Sourcing

Automotive Telematics PCB Manufacturer — HDI & RF PCB for GPS Tracker, CAN Bus & IoT

From 4-layer GNSS tracker boards to 12-layer ADAS camera HDI stacks, Superb Automation fabricates PCBs for telematics, vehicle electronics, and industrial IoT. Our PCB capabilities cover the full range: Rogers RF laminates for GPS/cellular front-ends, high-Tg FR4 for under-hood CAN modules, HDI microvias for miniature asset trackers, and hybrid stacks for multi-radio IoT gateways. 1–68 layers, prototype to 50K/month volume.

16-Layer High Density Multilayer PCB Manufacturing for Precision Electronic Systems

Superb manufactures high density multilayer PCB including 16 layer PCB, complex stack-up PCB, signal integrity controlled PCB and precision PCB assembly solutions.

Bluetooth Earphone PCB — 8L 2-Step, ENIG | Superb Automation

8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber

​14-Layer 6-Step HDI — High-Voltage Power Transformer Module

14-layer 6-step HDI · 70 μm heavy copper · PTFE+FR4 · 2.5 mm · AC withstand > 2000 V · ENIG · Layer offset < 30 μm · Stacked laser via · Build-to-print from Gerber

Heavy Copper / High-Thermal PCB Fabrication

Heavy copper PCB manufacturing — 16 layers · 5 oz inner copper · 3.75 mm · Press-fit ±0.05 mm · Resin plug · Blind via · Build-to-print from Gerber files

Multilayer Backplane PCB — 10G Signal Integrity Simulation

10+ Pairs 10G Signals | System-Level Backplane SI Simulation | Connector Supplier Coordination | Functional Test Passed

Communication Board Signal Integrity Simulation

60,000 Pins | SFP+ · Interlaken · QPI · PCIe3 · DDR4 · DDR3 | TU872SLK-sp | Intel Platform Loss Spec | 1-Month Turnaround

Communication Mainboard PCB — High-Density BGA Fanout Design

Lattice CPLD + TI FPGA · 4 Bottom-Plate Connectors · 3× Differential · Mid-Board Cutouts · 10–14 Layers · Superb Automation

Intel H81 Mini-ITX Industrial Control Motherboard PCB

6–8 Layer · DDR3L · Dual GbE · 10× COM · PCIe 16X · LVDS · mSATA/mPCIe · 8× USB · High-Density Layout · Superb Automation

Bluetooth Module PCB — RO4350B, ENEPIG, 4L | Superb Automation

Rigid-Flex / Flex PCB Fabrication

Rigid-flex PCB manufacturing — 14 layers · 10 rigid + 4 flex · 2+2 split · 2.2 mm · Panasonic · 3 mil line · Lead-free HASL · Build-to-print from Gerber files

20L Hybrid PCB — PTFE+FR4, Embedded R, Blind | Superb Automation

Hybrid PCB manufacturing — PTFE+FR4 · 20 layers · 5.7 mm · 4-step blind via · Blind slot · Embedded resistors · Back drill · Build-to-print from Gerber files