Multilayer Backplane PCB — 10G Signal Integrity Simulation 10+ Pairs 10G Signals | System-Level Backplane SI Simulation | Connector Supplier Coordination | Functional Test Passed
Communication Board Signal Integrity Simulation 60,000 Pins | SFP+ · Interlaken · QPI · PCIe3 · DDR4 · DDR3 | TU872SLK-sp | Intel Platform Loss Spec | 1-Month Turnaround
18-Layer High-Speed Multilayer PCB — Panasonic M6, 64Gbps, 20:1 Aspect Ratio High-speed digital PCB with 18 layers on Panasonic M6 (R-5775) laminate. 4.0 mm finished thickness, 0.20 mm minimum drill at 20:1 aspect ratio. Double-sided back-drilling with stub < 0.08 mm. Differential impedance control ±7.5% (≤ 50 Ω) and ±5% (> 50 Ω). 64 Gbps NRZ/PAM4 signaling capability.
8-Layer Optical Fiber Transmission PCB 2.60 mm Thick · 4/5 mil Trace/Space · ENIG · 0.19 mm Micro-Via · Case Study: 10G Optical Fiber Transmission Board
6-Layer High-Speed Communication PCB 483.61 × 279.15 mm · 4/4 mil Trace/Space · ENIG · Full DFM Report · Case Study: dm6446-v3.0-0331-2
18-Layer TU883 2oz ENIG PCB for High-Current Power Distribution Backplane 18-Layer 2nd-Order HDI · 2oz Thick Copper · TU883 · 2.6mm · ENIG; High-Current Power Distribution Backplane
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