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High-speed PCB Sourcing

8-Layer Optical Fiber Transmission PCB

8-Layer Optical Fiber Transmission PCB

This page documents the build-to-print fabrication of an 8-layer 10G optical fiber transmission PCB at 2.60 mm finished thickness. The board carries high-density BGA processors alongside 10 Gbps optical transceiver interfaces — SFP+ cages and associated high-speed differential pairs — on a compact 145.40 × 91.99 mm form factor. Superb Automation operates on a strict build-to-print model — we receive customer Gerber, drill, and stackup files, perform engineering conversion and DFM process validation, and deliver finished boards. The board was fabricated with 4/5 mil trace/space rules, ENIG surface finish with high gold-coverage area, and 0.19 mm minimum plated micro-vias — a specification that pushes the ultra-high aspect ratio boundary (>13:1 at 2.60 mm board thickness). The manufacturing process is supported by a comprehensive process chart integrating the full 8-layer stackup, BGA routing layout, and complete drill schedule, alongside an 8-module DFM inspection report with 3-tier defect grading (pass / warning / danger). This build represents the high-complexity end of our standard multilayer PCB production capability.

6-Layer High-Speed Communication PCB

6-Layer High-Speed Communication PCB

This page showcases a 6-layer high-speed communication PCB manufactured for 19-inch rack-mount industrial network equipment — including managed Ethernet switches, edge computing gateways, and data-center network mainboards. Fabricated to the customer's Gerber specifications at 483.61 × 279.15 mm with 4/4 mil trace/space rules and ENIG surface finish, the board integrates high-density BGA processors, DDR memory, multi-port optical/electrical interfaces, and high-speed differential pairs on a single un-segmented 6-layer stackup. A full DFM analysis report covering 24 inspection categories was completed before production release, and 3,589-point flying-probe electrical testing verified 100% netlist continuity. This build is representative of the complex communication boards Superb Automation manufactures daily — from prototype verification through volume ramp. The accompanying manufacturing process chart integrates the complete layer stackup, global routing layout, and full drill schedule into a single engineering reference. Combined with the DFM report's 3,589-point flying-probe netlist, this documentation package serves as the unified process baseline for PCB fabrication, SMT assembly, and quality assurance — eliminating multi-party communication gaps between R&D, procurement, PCB fab, and assembly house.