01
Incoming Inspection
PCB & component verification 鈥?visual, date code, packaging integrity check
PCBA Production Process
02
Solder Paste Printing
Laser-cut stencil + automatic printer 鈥?precise paste deposition on every pad
03
3D SPI Inspection
3D solder paste inspection 鈥?verifies volume, height & area before placement
04
SMT Pick & Place
High-speed chip shooter + multi-function placer 鈥?0201 to 55mm BGA
05
Reflow Soldering
10-zone oven with nitrogen option 鈥?SAC305 lead-free as standard
06
3D AOI 鈥?Post Reflow
3D automated optical inspection 鈥?every visible solder joint checked
07
3D X-Ray 鈥?BGA & QFN
CT X-ray for hidden joints 鈥?voiding analysis & head-in-pillow detection
08
Through-Hole Insertion
Manual & automated DIP insertion 鈥?connectors, transformers, relays
09
Wave / Selective Soldering
Wave for through-hole boards 鈥?selective soldering for mixed-technology
10
Post-Solder AOI
Final optical inspection after all soldering processes
11
ICT 鈥?In-Circuit Test
Bed-of-nails or flying probe 鈥?verifies component values & connections
12
FCT 鈥?Functional Test
System-level test under operating conditions 鈥?custom fixtures & programs
13
Conformal Coating
Acrylic / silicone / urethane coating for moisture, dust & chemical protection
14
Box Build Assembly
Enclosure assembly, cable routing, display mounting, thermal management
15
IC Programming
Firmware flashing & configuration via JTAG, SWD, UART or USB
16
Final Inspection & Labeling
Visual check, serial number scanning, custom labeling & branding
17
Packaging & Shipping
Anti-static packaging, custom retail boxes, multi-pack carton 鈥?ready to ship
PCBA workshop resources
PCBA Manufacturing Equipment
Automatic Stencil Printer
Laser-cut stencil with precise solder paste deposition on every pad. +/-25um alignment accuracy.
3D SPI - Solder Paste Inspection
Volume, height & area measurement on every pad before placement. Catches printing defects early.
High-Speed Chip Shooter
0201 to larger passives 鈥?speeds up to 60,000 CPH. 7 lines running in parallel.
Multi-Function Placer
ICs, BGAs up to 55mm, QFN, QFP, connectors & odd-form parts with 0.01mm precision.
10-Zone Reflow Oven
Nitrogen atmosphere option. Precise thermal profiling for lead-free SAC305, +/-1掳C uniformity.
Wave Soldering Machine
Through-hole component soldering with dual wave for reliable hole fill. Ideal for connectors and relays.
Selective Soldering Machine
Mixed-technology boards 鈥?SMT + through-hole without damaging SMT parts. Precise nozzle control.
3D AOI - Post Reflow
Automated optical inspection of every visible solder joint. Multi-angle lighting catches 50+ defect types.
3D X-Ray (CT)
BGA, QFN, LGA hidden joint inspection. Voiding analysis & head-in-pillow detection with <5% void rate.
Quality Control & Testing
3D SPI
Solder paste volume, height, area 鈥?catches printing defects before a single component is placed.
3D AOI - Post Reflow
Component presence, polarity, solder bridges, insufficient solder, lifted leads 鈥?every visible joint checked.
3D X-Ray (CT)
BGA/QFN hidden joints 鈥?voiding %, head-in-pillow, solder ball shape. Reliability verified layer by layer.
PCBA Factory Tour
Step inside our 5,000sqm SMT cleanroom 鈥?7 lines, 15 million placements per day.
Factory Overview
One continuous walkthrough: stencil printing 鈫?pick & place 鈫?reflow 鈫?AOI 鈫?X-Ray 鈫?testing. 7 lines in action.
Quality Standards We Follow
Every board is manufactured and inspected to these industry standards 鈥?no exceptions.
IPC-A-610 Class 2 / Class 3
Acceptability of Electronic Assemblies 鈥?the global benchmark for solder joint quality. We inspect to Class 2 as standard, Class 3 for aerospace, medical, and military-grade products where zero-defect reliability is non-negotiable.
IPC J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies 鈥?governs materials, methods, and verification criteria for every solder joint. All our operators are trained and certified to this standard.
IPC-6012
Qualification and Performance Specification for Rigid Printed Boards 鈥?defines acceptance criteria for PCB fabrication. Every incoming bare PCB is verified against IPC-6012 before assembly begins.
Lead-Free SAC305
Tin-Silver-Copper (Sn96.5/Ag3.0/Cu0.5) 鈥?the industry-standard lead-free alloy. Compliant with RoHS and REACH. Leaded soldering (Sn63/Pb37) available on request for exempt applications.
Nitrogen Reflow Soldering
Inert nitrogen atmosphere prevents oxidation during reflow 鈥?dramatically reduces solder balling and voiding. BGA void rate consistently below 5%, exceeding IPC-7095 Class 3 requirements (<30%).
ESD S20.20
Electrostatic Discharge Control Program 鈥?full ESD-safe facility with grounded workstations, ionizers, conductive flooring, and dissipative packaging. Every operator wears ESD smocks, heel straps, and wrist straps.
IPC-CC-830 Conformal Coating
Qualification and Performance of Electrical Insulating Compound 鈥?governs coating thickness, coverage, adhesion, and dielectric strength. Applied to protect against humidity, salt spray, fungus, and corrosive gases in harsh environments.
IPC-7095 BGA Design & Assembly
Design and Assembly Process Implementation for BGAs 鈥?governs BGA placement, reflow profiling, voiding criteria, and X-ray inspection methodology. Our <5% void rate exceeds the Class 3 requirement of <30% by a wide margin.