MT41K128M16JT-125:K
The MT41K128M16JT-125:K is a 2 Gb (256 MB) DDR3L SDRAM component from Micron Technology, organized as 128M × 16-bit and rated for DDR3L-1600 (1600 MT/s, PC3-12800). At 1.35V with full backward compatibility to 1.5V DDR3, it delivers twice the density of the 1Gb MT41K64M16 in the same 96-ball FBGA package — 3.2 GB/s peak bandwidth from a single chip for FPGA configuration, embedded Linux, and industrial controllers where 128 MB is too tight and migrating to DDR4 carries unnecessary overhead.
Product Specifications
MT41K128M16JT-125:K — 2Gb DDR3L-1600 SDRAM by Micron Technology
The MT41K128M16JT-125:K is a 2 Gb (256 MB) DDR3L SDRAM component from Micron Technology, organized as 128M × 16-bit and rated for DDR3L-1600 (1600 MT/s, PC3-12800). At 1.35V with full backward compatibility to 1.5V DDR3, it delivers twice the density of the 1Gb MT41K64M16 in the same 96-ball FBGA package — 3.2 GB/s peak bandwidth from a single chip for FPGA configuration, embedded Linux, and industrial controllers where 128 MB is too tight and migrating to DDR4 carries unnecessary overhead.
Part Number Decoded — Field by Field
| Field | Value | Meaning |
|---|---|---|
| MT41K | Product Prefix | Micron DDR3L SDRAM. "K" = DDR3L generation (1.35V optimized, backward compatible to 1.5V) |
| 128M | Row Address Space | 128 Mega-locations — double the 64M on MT41K64M16. Each = 16 bits (×16). Total = 128M × 16 = 2,048 Mb = 2 Gb = 256 MB per chip |
| 16 | Data Bus Width | ×16 — 16 data lines (DQ0–DQ15), two data strobe pairs (UDQS, LDQS) |
| JT | Package Code | 96-Ball FBGA, 8 mm × 14 mm body, 0.8 mm ball pitch. Physically identical to TW package |
| -125 | Speed Grade | tCK = 1.25 ns (minimum clock period). Clock = 800 MHz → Data Rate = 1600 MT/s. DDR3L-1600 / PC3-12800 / CL = 11 |
| :K | Temperature/Revision | Commercial temperature grade: 0°C to +95°C TC. ":" is Micron's field delimiter. K = tray packaging designation |
⚠️ Lifecycle Status — Important
| Variant | Status | Notes |
|---|---|---|
| MT41K128M16JT-125 -M-K | ❌ Obsolete | Micron official obsolete catalog — DO NOT design in |
| MT41K128M16JT-125 V:K | ❌ Obsolete | DigiKey confirmed — no longer manufactured |
| MT41K128M16JT-125 :K | ✓ Active / Mature | Orderable via Mouser (340-135795-TRAY), Newark, and trusted distribution |
| MT41K128M16JT-125 IT:K | ✓ Active / Mature | Industrial temperature variant (−40 to +85°C) |
| MT41K128M16JT-125 AIT:K | ✓ Active | Extended industrial (−40 to +95°C) |
⚠️ Verify suffix before ordering. The MT41K128M16JT-125 base part has multiple suffix variants. The :K (commercial temperature) variant remains actively orderable as of mid-2026. The -M-K and V:K suffixes are obsolete. Always confirm the exact suffix on your BOM and verify current lifecycle status with Micron before committing to a new design. SUPERB Automation can assist: pcba@superb-tech.com.
Quick Specifications
| Parameter | Value |
|---|---|
| Manufacturer | Micron Technology |
| Part Number | MT41K128M16JT-125:K |
| Mouser # | 340-135795-TRAY |
| Type | DDR3L SDRAM (Low-Voltage DDR3, JEDEC JESD79-3-1 Compliant) |
| Density | 2 Gb = 256 MB per Chip (2× the MT41K64M16 1Gb density) |
| Organization | 128M × 16-bit |
| Speed Grade | DDR3L-1600 (PC3-12800) |
| Data Rate | 1600 MT/s |
| Clock Frequency | 800 MHz |
| tCK (Minimum) | 1.25 ns |
| CAS Latency (CL) | 11 (at DDR3L-1600) |
| tRCD / tRP | 11 cycles (~13.75 ns each at tCK=1.25 ns) |
| Cycle Time (tRC) | ~48.75 ns (39 cycles at tCK=1.25 ns) |
| Internal Banks | 8 Banks (Standard DDR3 Architecture) |
| Page Size | 2 KB per Page |
| Prefetch | 8n-Prefetch (DDR3 Standard) |
| Supply Voltage (VDD/VDDQ) | 1.35 V (DDR3L Low-Voltage Mode) — Backward Compatible to 1.5 V (Standard DDR3) |
| Active Read Current (IDD4R) | ~180–250 mA per Chip (at DDR3L-1600) |
| Standby Current (Self-Refresh) | ~25–35 mA (Typical) |
| Package | 96-Ball FBGA (8 × 14 mm, 0.8 mm Ball Pitch) |
| Temperature Grade | Commercial: 0°C to +95°C TC (Case Temperature) |
| Industrial Variant | MT41K128M16JT-125 IT:K (−40°C to +85°C) |
| Extended Industrial | MT41K128M16JT-125 AIT:K (−40°C to +95°C) |
| Packaging | Tray (Standard, ":K" suffix); TR = Tape & Reel |
| RoHS | Compliant |
Product Overview
The MT41K128M16JT-125:K is the 2Gb density member of Micron's DDR3L SDRAM family — delivering 256 MB per chip in the same 96-ball FBGA package as the 1Gb MT41K64M16. For embedded system designers, this means a single-chip upgrade path from 128 MB to 256 MB without PCB layout changes — only a BOM-line-item swap. Two chips on a 32-bit bus provide 512 MB — the practical upper limit of what most embedded DDR3/DDR3L memory controllers support.
At DDR3L-1600 with tCK = 1.25 ns and CL = 11, the part achieves a more relaxed timing envelope compared to the -107 speed grade (DDR3L-1866, tCK=1.07ns). This makes it a better match for existing PCBs designed for DDR3-1333 or DDR3-1600 — the 13.75 ns CAS latency and 48.75 ns row cycle time provide comfortable timing margins on 4-layer boards with moderate trace lengths.
The MT41K128M16JT-125:K serves a specific niche: systems that need more memory than 1Gb provides (256 MB vs 128 MB) but whose memory controllers do not support DDR4, or where the effort of migrating a qualified BOM and PCB layout from DDR3L to DDR4 is not justified by the performance gain. It is the highest-density DDR3L chip commonly available in the 96-ball FBGA form factor.
Key Features & Benefits
256 MB per Chip — Double the 1Gb Density, Same Package
At 2 Gb, the MT41K128M16JT-125:K provides 256 MB in a single 96-ball FBGA — the maximum density achievable in the standard 8×14mm DDR3L package. This enables:
Single-chip 16-bit bus: 256 MB — sufficient for a complete embedded Linux system (kernel + rootfs + application) without external NOR/NAND
Dual-chip 32-bit bus: 512 MB — headroom for complex applications (video decode framebuffers, database caching, Python/Lua runtime)
PCB compatibility: Same 96-ball FBGA footprint as 1Gb MT41K64M16 — upgrade from 128MB to 256MB with a BOM swap, no PCB redesign
DDR3L 1.35V — Power Savings Without Compromise
Operating at 1.35V reduces IO power by approximately 15-20% compared to standard 1.5V DDR3 at the same speed. In a 4-chip ×16 configuration (1 GB total), this translates to ~200-300 mW of power savings — meaningful in thermally constrained enclosures where every watt matters. Full backward compatibility to 1.5V DDR3 ensures drop-in replacement for legacy designs.
DDR3L-1600: The Broadest Embedded Speed Compatibility
DDR3L-1600 (800 MHz clock) is the most widely supported DDR3 speed grade across embedded SoCs — from NXP i.MX6 to Xilinx Zynq-7000 to TI AM335x. Compared to the -107 (1866 MT/s) speed grade, the -125 (1600 MT/s) offers:
Relaxed timing margins: tCK=1.25 ns vs 1.07 ns — ~17% wider timing window for DQ-DQS alignment
Better PCB compatibility: Works reliably on 4-layer boards with standard FR4 trace lengths
Lower power: Slightly reduced dynamic current at 800 MHz vs 933 MHz
Drop-In Upgrade from 1Gb to 2Gb — Same Package, Same Controller
Both the MT41K64M16 (1Gb) and MT41K128M16 (2Gb) use the identical 96-ball FBGA package with the same pinout and ball assignments. Upgrading requires only:
Swap the BOM line item from MT41K64M16 to MT41K128M16
Update the memory controller's density configuration register (total row address bits increase from 13 to 14 for 128M vs 64M row addresses)
Verify the power supply can source the slightly higher IDD current (~180-250 mA vs ~150-200 mA)
No PCB layout changes required — the additional row address bit (A13) is already routed on the PCB (the 96-ball FBGA pads all row/column address pins regardless of which density part is populated).
MT41K128M16JT-125 Family — Complete Suffix Map
| Variant | Temperature | Packaging | Status |
|---|---|---|---|
| MT41K128M16JT-125:K | 0°C to +95°C | Tray | ✓ Active |
| MT41K128M16JT-125:K TR | 0°C to +95°C | Tape & Reel | ✓ Active |
| MT41K128M16JT-125 IT:K | −40°C to +85°C | Tray | ✓ Active |
| MT41K128M16JT-125 AIT:K | −40°C to +95°C | Tray | ✓ Active |
| MT41K128M16JT-125 M:K | 0°C to +95°C | Tray | ❌ Obsolete |
| MT41K128M16JT-125 V:K | 0°C to +95°C | Tray | ❌ Obsolete |
2Gb vs 1Gb DDR3L — Which Density for Your Design?
| Feature | MT41K128M16JT-125:K (2Gb) | MT41K64M16TW-107:J (1Gb) |
|---|---|---|
| Density per Chip | 256 MB | 128 MB |
| Speed Grade | DDR3L-1600 | DDR3L-1866 |
| tCK (Min) | 1.25 ns | 1.07 ns |
| Clock Frequency | 800 MHz | 933 MHz |
| CAS Latency (CL) | 11 | 13 |
| 32-bit Bus (2 Chips) | 512 MB @ 6.4 GB/s | 256 MB @ 7.5 GB/s |
| Package | 96-FBGA (8×14mm) | 96-FBGA (8×14mm) |
| Pin Compatibility | Yes — identical footprint and pinout | |
| Best For | Linux systems needing 256+ MB | FPGA config / light RTOS |
Selection guide: If your system needs >128 MB per chip and your memory controller supports DDR3L-1600, the 2Gb MT41K128M16 is the right choice. If you need the absolute fastest DDR3L speed (1866 MT/s) and 128 MB is sufficient, the 1Gb MT41K64M16-107 offers ~17% higher peak bandwidth at half the density.
Target Applications
Embedded Linux SBCs (256-512 MB)
Two MT41K128M16JT-125:K chips on a 32-bit bus deliver 512 MB DDR3L — the standard memory configuration for NXP i.MX6, TI AM335x, and Xilinx Zynq-7000 SBCs running Yocto or Buildroot. 512 MB comfortably supports a full Linux userspace with Python, Node.js, or a lightweight database (SQLite).
Xilinx Zynq-7000 Processing System DDR
The Zynq-7000 PS DDR controller supports up to 1 GB of DDR3/DDR3L. A 4-chip ×16 configuration of MT41K128M16 (4 × 256 MB) provides 1 GB — the maximum the Zynq-7000 supports — at DDR3L-1600 with 32-bit bus width. This configuration is widely used in Zynq-based software-defined radio, machine vision, and industrial control platforms.
Digital Signage & HMI Panels
Embedded HMI controllers (TI AM62x, Rockchip RK3288, Allwinner A40i) driving 720p/1080p LCD panels benefit from 512 MB DDR3L for framebuffer + application memory. DDR3L-1600's 6.4 GB/s 32-bit bandwidth comfortably handles 1080p60 RGBA framebuffer reads without visible tearing.
Networking Equipment — Legacy DDR3L Platforms
Enterprise Wi-Fi 5 access points, SD-WAN edge devices, and Layer 2 managed switches built on Broadcom/Marvell/Qualcomm networking SoCs with DDR3L memory controllers. The 2Gb density supports larger forwarding tables and deeper packet buffers compared to 1Gb alternatives.
Industrial Control & PLCs
CODESYS and IEC 61131-3 runtime environments running on DDR3L-based embedded controllers. 512 MB supports complex automation programs with multiple runtime tasks, OPC UA server, and web-based HMI — all in a fanless DIN-rail form factor.
FPGA Frame Buffers & Data Acquisition
High-speed data acquisition cards using Xilinx Artix-7/Kintex-7 or Intel Cyclone V FPGAs with external DDR3. A single MT41K128M16 provides 256 MB of sample buffer — adequate for 14-bit, 100 MSPS ADC capture over several milliseconds without external FIFO chips.
Frequently Asked Questions
Is the MT41K128M16JT-125:K obsolete?
The :K variant is NOT obsolete. It is actively orderable through Mouser (340-135795-TRAY), Newark, and other trusted Micron distributors as of mid-2026. However, two related suffixes HAVE been obsoleted: the -M-K variant (confirmed in Micron's obsolete catalog) and the V:K variant (confirmed by DigiKey). The :K and IT:K variants remain in production. Always verify the exact suffix on your BOM — ordering the wrong variant (M:K instead of :K, for example) may result in an EOL part. Contact pcba@superb-tech.com for current lifecycle confirmation.
What is the difference between :K, IT:K, and AIT:K?
These are identical silicon with different temperature testing/binning:
:K — Commercial: 0°C to +95°C TC. Indoor, climate-controlled environments.
IT:K — Industrial: −40°C to +85°C TC. Outdoor, factory floor, unheated enclosures.
AIT:K — Extended Industrial: −40°C to +95°C TC. Automotive-adjacent, under-hood, high ambient.
Choose :K for standard commercial/indoor; choose IT:K for outdoor and industrial; choose AIT:K for the widest temperature range.
Can the MT41K128M16JT-125:K replace a 1Gb MT41K64M16 in an existing design?
Yes — with one firmware change. Both use the identical 96-ball FBGA package and pinout. The MT41K128M16 (2Gb) uses 14 row address bits (A0–A13) vs the MT41K64M16 (1Gb) which uses 13 bits (A0–A12). The additional A13 pin is already connected on the PCB — you only need to update the memory controller's row address width configuration register to 14 bits. No PCB changes required. Verify the power supply can handle the slightly higher active current.
Can the MT41K128M16JT-125:K run at 1.5V in a standard DDR3 design?
Yes. All MT41K (DDR3L) devices operate correctly at both 1.35V and 1.5V. The designation "DDR3L" means "DDR3 Low-voltage capable" — it is a superset of standard DDR3. Set VDD/VDDQ to 1.5V, and the chip behaves identically to a standard 1.5V-only DDR3 part. The reverse is NOT true: a 1.5V-only MT41J must not be operated at 1.35V.
What is the minimum order quantity (MOQ)?
Contact SUPERB Automation for a tailored quote. We support prototype tray quantities through full production volumes. Send your BOM to pcba@superb-tech.com — we quote within hours. Please specify whether you need :K (commercial), IT:K (industrial), or AIT:K (extended industrial) temperature grade.
How long will the MT41K128M16JT-125:K remain available?
DDR3L is a mature technology, and Micron has committed to long-term availability for embedded DRAM products. While some suffix variants have been obsoleted (M:K, V:K), the core :K and IT:K variants remain in active production. For new designs with multi-year production lifecycles, evaluate migration to DDR4 (MT40A family) for maximum long-term roadmap security. SUPERB Automation can assist with lifecycle verification and last-time-buy planning — contact pcba@superb-tech.com.
Ordering Information
| Orderable Part Number | Mouser # | Temperature | Package | Speed |
|---|---|---|---|---|
| MT41K128M16JT-125:K | 340-135795-TRAY | 0°C to +95°C | 96-FBGA, Tray | DDR3L-1600 |
| MT41K128M16JT-125:K TR | — | 0°C to +95°C | 96-FBGA, T&R | DDR3L-1600 |
| MT41K128M16JT-125 IT:K | — | −40°C to +85°C | 96-FBGA, Tray | DDR3L-1600 |
| MT41K128M16JT-125 AIT:K | — | −40°C to +95°C | 96-FBGA, Tray | DDR3L-1600 |
Design Resources
Datasheet: Micron MT41K128M16 — DDR3L SDRAM 2Gb Component Data Sheet (full electrical, timing, and package specifications)
JEDEC Standard: JESD79-3-1 — DDR3L SDRAM Standard (1.35V low-voltage addendum to JESD79-3 DDR3)
Application Note: Micron TN-41-01 — "DDR3 Point-to-Point Design Guide" (PCB layout, signal integrity, and power delivery for DDR3/DDR3L designs)
Migration Guide: Micron TN-41-13 — "Migrating from DDR3 to DDR3L" (regulator changes, timing impact, backward-compatibility verification)
IBIS Model: Available from Micron for signal integrity simulation at DDR3L-1600
Footprint / Symbol: Available from SnapEDA, Ultra Librarian — 96-ball FBGA, 8×14mm, 0.8mm pitch
FPGA MIG Reference: Xilinx MIG 7-Series and Zynq-7000 DDR3/DDR3L controller parameter settings for 2Gb density configuration
Request a Quote
SUPERB Automation supplies genuine Micron MT41K128M16JT-125:K DDR3L SDRAM with full traceability. From prototype tray quantities for board bring-up to production tape-and-reel volumes, we deliver — with transparent lifecycle status communication for mature-technology parts.
Send your BOM or inquiry to pcba@superb-tech.com — we quote within hours. Include your target temperature grade (:K, IT:K, or AIT:K), packaging preference (tray or TR), and annual volume forecast.
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