Bluetooth Earphone PCB — 8L 2-Step, ENIG | Superb Automation 8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber
14-Layer 6-Step HDI — High-Voltage Power Transformer Module 14-layer 6-step HDI · 70 μm heavy copper · PTFE+FR4 · 2.5 mm · AC withstand > 2000 V · ENIG · Layer offset < 30 μm · Stacked laser via · Build-to-print from Gerber
6 layer UltraThin HDI Camera Board 6-layer ultra-thin HDI camera board by Superb Automation. 0.6mm finished thickness, 3/3mil trace/space, 4mil laser blind vias, ENIG finish, FR4 Tg≥150°C substrate. Optimized for MIPI D-PHY/C-PHY at 2.5Gbps/lane with <0.2dB/mm insertion loss at 3GHz.
.webp "14-Layer 6-Step HDI — High-Voltage Power Transformer Module")
English
English