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Advanced Multi-Layer BGA Package Substrate for CPU, Power Module and Processor IC Applications. With the rapid development of semiconductor technology, traditional PCB solutions cannot meet the requirements of high-density chip packaging. IC Package
Not all PCBA manufacturers understand RF. Not all RF shops understand automotive reliability. And almost none understand both — plus the ultra-low-power demands of IoT. If you're building a Starlink tracker, an eCAN module, an eEye ADAS camera, or a
High-Density Interconnect (HDI) PCBs use laser-drilled micro-vias — as small as 0.05 mm — to connect layers at far higher density than conventional through-hole vias. Superb Automation manufactures HDI boards up to 30-layer ELIC (Every Layer Intercon
The MT41K128M16JT-125:K is a 2 Gb (256 MB) DDR3L SDRAM component from Micron Technology, organized as 128M × 16-bit and rated for DDR3L-1600 (1600 MT/s, PC3-12800). At 1.35V with full backward compatibility to 1.5V DDR3, it delivers twice the density
The MT41K64M16TW-107:J is a 1 Gb (128 MB) DDR3L SDRAM component from Micron Technology, organized as 64M × 16-bit and rated for DDR3L-1866 (1866 MT/s, PC3-14900). Operating at just 1.35V with full backward compatibility to standard 1.5V DDR3, it deli
The MT40A512M16TB-062E:R is an 8 Gb (1 GB) DDR4 SDRAM component from Micron Technology, organized as 512M × 16-bit and rated for DDR4-3200 (3200 MT/s, PC4-25600). Packaged in a compact 96-ball TFBGA, it delivers 12.8 GB/s of peak bandwidth in a dual-
The MT41K256M16TW-107:P is a 4Gb DDR3L SDRAM from Micron Technology, organized as 256M words x 16 bits with a peak data rate of 1866 MT/s (DDR3-1866). Operating at the low-voltage 1.35V DDR3L standard, it delivers the same 1866 MT/s bandwidth as stan
The ADRV9009BBCZ is a highly integrated dual RF transceiver from Analog Devices, combining dual independent transmitters, dual receivers, and dual observation receivers in a single 196-CSPBGA package. Covering 75 MHz to 6 GHz with up to 200 MHz recei
RF Transceiver Board PCBA. RF PCBA, Power Amplifier, LNA, RF Front-End, Phased Array, Beamforming, Antenna Array, Frequency Synthesizer, Rogers PCB
20 Mitsubishi laser drills (5Z00U & ML605GTW5) for micro-via processing. Hole sizes down to 0.1mm for any-layer HDI. High-volume throughput for smartphones, ADAS, and 5G base stations.
PCBA BGA soldering inspection and processing is a critical step in modern electronics manufacturing, as even tiny defects under the BGA component can lead to full device failure after assembly. This guide walks through practical, field-tested methods
IPC-9701 defines thermal cycling test methods for evaluating solder joint reliability. Superb uses IPC-9701 as the reference for thermal stress testing — -40°C to +125°C cycling, in-situ electrical monitoring, and post-cycle failure analysis.
IPC-7711/7721 defines correct procedures for rework and repair of PCBA assemblies. Superb's rework technicians follow these standards for component replacement, BGA reballing, trace repair, and conformal coating removal — fixing defects without creat
IPC-7095 governs BGA design, placement, reflow profiling, void criteria, and X-ray inspection. Superb Automation achieves sub-5% BGA void rates — well below the IPC Class 3 requirement of under 30%.
GPU FCBGA Package Substrate: 2.5D/3D Advanced Packaging ExplainedJune 21, 2026 · Superb Electronics · 8 min readFCBGA2.5D3D PackagingABF SubstrateTheFCBGA (Flip Chip Ball Grid Array) package substrateis the critical interface between a GPU silicon di
- View-x1800 X-Ray machine. Hidden BGA, QFN & LGA joint inspection. Voiding analysis, head-in-pillow detection & solder ball verification. IPC-7095 compliant.
DECAN S2 multi-function placer. Speed: 96,000 CPH. Min part: 01005. Max part: 42mm. PCB size: 1200mm × 460mm. Handles BGA, QFN, QFP, connectors & odd-form parts with precision.
VBsemi VBGA1156N is a discrete semiconductors component designed for DC-DC Converters & Power Supplies and related applications. In stock at Superb Automation — request a quote for competitive pricing and fast delivery.
IPC-A-610 defines three classes of electronics assembly — Class 1 (function only), Class 2 (dedicated service, commercial/industrial), and Class 3 (high performance, life-critical). This article breaks down the measurable differences: BGA void limits
Lattice CPLD + TI FPGA · 4 Bottom-Plate Connectors · 3× Differential · Mid-Board Cutouts · 10–14 Layers · Superb Automation