Tag: BGA

The AD9363BBCZ is a high-performance 2×2 RF Agile Transceiver™ purpose-built for 3G and 4G femtocell base stations. It combines best-in-class receiver sensitivity (−122dBm), ultralow transmitter EVM (−34dB), and a highly integrated direct-conversion

High-precision IC carrier board with 132 Au wire-bond fingers, 144 solder ball pads, and center die-attach thermal pad — achieving CPK 4.08 on gold finger width.

The AD9361BBCZ is a high-performance, highly integrated 2×2 RF Agile Transceiver (2 transmit, 2 receive channels) from Analog Devices. It combines an RF front end with flexible mixed-signal baseband processing in a single 144-ball CSP-BGA package. Op

The AD9364BBCZ is a high-performance, highly integrated 1×1 RF Agile Transceiver from Analog Devices. Operating from 70 MHz to 6 GHz, it covers most licensed and unlicensed bands — making it suitable for software-defined radio (SDR), cellular base st

2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board

10-layer high-precision multilayer main control PCB: 1.60mm, 4/4 mil, ENIG, high-density BGA. Build-to-print from Gerber files. Full DFM, symmetrical lamination. RFQ

2.60 mm Thick · 4/5 mil Trace/Space · ENIG · 0.19 mm Micro-Via · Case Study: 10G Optical Fiber Transmission Board

4-layer industrial control PCB: 4× DDR top/bottom, 167.64×111.15mm, 4/4 mil, ENIG. DFM verified, impedance controlled. Prototype to volume

AOI sees what the eye can see — and does it thousands of times per minute with machine consistency. X-ray sees what AOI cannot: the solder joints hidden beneath BGA, QFN, and CSP packages. This article compares both methods, explains when each is suf

Beyond Traditional PCBs: FCBGA, HDI, and SLP in AI Chip PackagingPublished: June 21, 2026 • Category: AI Compute • Reading Time: 18 minTable of ContentsThe Convergence of PCB and PackagingFCBGA Substrates: The Workhorse of AI PackagingHDI Substrates

The XCR3128XL-10TQG144C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.

The XC95144XL-7TQ144C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.

The XC95144XL-5TQG144C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.

The XC3550AN-4TQG144C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.

The XC3550-4TQG144C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.

The XC3S400-4FGG456C from XILINX is a Spartan-3 programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.

The XC3S1400A-4FTG256C from XILINX is a Spartan-3 programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.

The XC3S1200E-5FTG256C from XILINX is a Spartan-3 programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.

The XC2V1000-5FGG256C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.

The XC2V1000-4FGG256C from XILINX is a FPGA programmable logic device offering high logic density, abundant DSP resources, and high-speed serial connectivity for advanced digital processing.