BT Resin IC Package Substrate PCB Solution
Advanced Multi-Layer BGA Package Substrate for CPU, Power Module and Processor IC Applications. With the rapid development of semiconductor technology, traditional PCB solutions cannot meet the requirements of high-density chip packaging. IC Package Substrate has become a critical connection platform between semiconductor dies and main PCB systems.
Product Specifications
0.03 mm
Line Width / Spacing
0.05 mm
Min. Laser Via
0.05 mm
Min. BGA Pitch
0.3 – 0.4 mm
Board Thickness
Product Applications
SUPERB IC Package Substrate PCB is widely used across semiconductor packaging.
CPU
CPU and processor IC packages
Power
Power management modules
BGA
BGA semiconductor packages
Control IC
High-density control IC
Automotive
Automotive semiconductor modules
Industrial
Industrial electronic chip packaging
Product Features
Multi-layer, multi-step interconnection technology for high-density signal transmission.
Feature 1
Multi-Layer BGA Package Substrate
SUPERB supports advanced multi-layer BGA substrate designs with high-density routing capability.
Multi-layer structure
Multi-level interconnection technology
Fine pitch BGA package support
High reliability signal transmission
Feature 2
BT Resin Material Technology
Material: BT (Bismaleimide Triazine) Resin
Advantages:
Excellent thermal resistance
High dimensional stability
Suitable for semiconductor packaging
Reliable electrical performance
BT substrate is widely used in:
CSP
BGA
RF modules
Memory packaging
Technical Capability
Our package substrate solutions support multi-layer, multi-step interconnection.
| Item | Capability |
|---|---|
| Substrate Type | Multi-layer BGA IC Package Substrate |
| Application | CPU, Power Module, Processor IC |
| Material | BT Resin |
| Board Thickness | 0.3 – 0.4mm |
| Minimum Laser Via | 0.05mm |
| Via Technology | Laser drilling + Copper Filling |
| Line Width / Spacing | 0.03mm / 0.03mm |
| Minimum Bonding Pitch | 0.04mm |
| Minimum BGA Pitch | 0.05mm |
| Solder Mask | AUS308 |
Advanced Process Capabilities
SUPERB IC substrate solutions integrate precision semiconductor-grade process technologies.
Process 1
Laser micro via drilling
Process 2
Copper electroplating filling
Process 3
Fine line circuit formation
Process 4
Multi-layer build-up technology
Process 5
High precision surface treatment
These technologies ensure:
✓
High-density interconnection
✓
Stable electrical performance
✓
Reliable semiconductor packaging
Why Choose SUPERB as Your IC Package Substrate Partner?
Our goal is to help customers reduce sourcing complexity by providing reliable semiconductor packaging PCB solutions.
1
IC Package Substrate PCB sourcing solution
2
Semiconductor packaging supply support
3
Customized substrate design capability
4
Small-volume to high-volume support
5
Global component and PCB supply chain integration
Request a Quote
Send your IC package substrate requirements — substrate type, layer count, material and BGA pitch — for a same-day quotation.
Email
info@superb-tech.com
WhatsApp
+8613396081443
Website
www.superb-tech.com