01
DFM Review
Engineering team checks your Gerber files before production starts - report in 24h.
PCB Production Process
02
Inner Layer Imaging
Dry film lamination -> LDI exposure -> develop -> etch -> strip for circuit formation.
03
AOI - Inner Layer
Automated optical inspection verifies inner layer patterns before lamination.
04
Oxide Treatment
Copper surface preparation for strong inter-layer bonding reliability.
05
Layup & Lamination
Stack cores + prepregs -> heat & pressure -> multilayer bonding up to 68 layers.
06
Drilling
CNC mechanical drill (0.15mm+) + laser micro-via (0.1mm) - aspect ratio up to 20:1.
07
Plasma Desmear
Cleans hole walls & activates PTFE/polyimide - essential for high-frequency materials.
08
Electroless Copper
Chemical copper deposition on hole walls - creates conductive base for electroplating.
09
Outer Layer Imaging
Same LDI process applied to outer copper - trace/space down to 2/2 mil.
10
Pattern Plating
Electrolytic copper plating + tin etch resist - builds trace thickness to spec.
11
Etching
Remove unwanted copper - leaving only the designed circuit pattern intact.
12
Solder Mask Application
LPI coating -> exposure -> development -> thermal cure. Standard green, custom colors.
13
Surface Finish
ENIG / Lead-Free HASL / OSP / Immersion Silver / Immersion Tin - matched to your design.
14
Silkscreen Printing
Component reference designators, polarity marks, logos - white, black or yellow ink.
15
Electrical Test
Flying probe or bed-of-nails - 100% net coverage: continuity & isolation verified.
16
Profiling
V-scoring or CNC routing to final board shape - clean edges, precise dimensions.
17
Final Inspection & Packing
Visual + dimensional check -> vacuum sealed -> labeled & ready to ship.
PCB workshop resources
PCB Manufacturing Equipment
Solder Mask Blasting Pretreatment
Universe solder mask blasting pretreatment GL231108B1025A (1 unit). Surface preparation before solder mask for optimal coating adhesion and zero bubbles.
Plasma Desmear
When Chemistry Fails, Physics Takes OverStandard FR-4 desmear uses aggressive permanganate chemistry - it etches epoxy resin smear from hole walls beautifully. But it fails complet
Solder Mask LPI Line
Taiyo & Tamura LPI solder mask. Apply, expose, develop, cure. Green standard; black, white, blue, red available. Precision dam formation between fine-pitch pads.
Vacuum Lamination Press
CEDATE (Italy) & HuoQuan vacuum lamination presses. Precision multilayer bonding up to 68 layers. Temperature and pressure controlled for void-free lamination.
LDI - Laser Direct Imaging
LDI fine-line exposure down to 2/2 mil trace/space. Synova S100807 (2 units) utilizing UV laser direct writing. Eliminates phototool for HDI precision with zero film alignment erro
Dry Film Laminator
Schmid & KCE dry film laminators for photoresist application on inner and outer layers. Horizontal and vertical coating with uniform thickness control.
DES Line
DES acid etching line GL231108B1027A (1 unit). 3 dedicated lines for Develop-Etch-Strip with real-time process monitoring.
AOI - Inner Layer
10 AOI stations (Orbotech Discovery/Spiron) catch shorts, opens & pattern defects on inner layers before lamination. Prevents costly multilayer scrap.
Oxide Treatment Line
ChuangKe & DengTai oxide treatment lines. Brown/black oxide copper surface preparation for maximum interlayer bonding in multilayer lamination.
Silkscreen Printer
In-house silkscreen printers for legend - component IDs, polarity marks, logos. White, black, or yellow ink. Permanent epoxy-based marking.
Final Inspection Station
40 inspection stations for visual check, dimensional measurement, vacuum packaging. Every board examined per IPC-A-600 before shipment.
Electroless Copper Line
Universe copper deposition pretreatment line GL231108B1032A + Atotech electroless copper. Chemical copper deposition creates conductive base for electrolytic plating.
Panel Plating Line
Dongwei vertical continuous plating line (8 copper) + Atotech/Schmid. Electrolytic copper plating to target thickness with heavy copper support for power electronics.
Flying Probe Tester
Wangtongda fully automatic tester GL231108B1045A + ATG flying probe. 100% net coverage without custom fixture. Fast prototype turnaround.
V-Scoring & Router
Shenghai single-blade V-CUT machine + YOWSUN. PCB profiling, depaneling & edge beveling. V-scoring for panelized boards, CNC routing for complex shapes.
X-Ray Drilling Target Machine
Taiwan Haoshuo X-Ray drilling target machine ADT-900. Precision X-ray drill target positioning for multilayer PCB layer-to-layer registration accuracy.
CNC Drilling Machine
CNC drilling machines including Taiwan Tongtai SD-62C 200,000 RPM (2 units), Hitachi, DongTai. Mechanical drilling down to 0.15mm, aspect ratio 20:1. 150+ spindles across our PCB w
Quality Control & Testing
AOI - After Solder Mask
Final AOI scan verifies solder mask coverage, pad alignment & legend quality after all processing. Last automated gate before electrical test.
AOI - Inner Layer
10 AOI stations catch shorts, opens & pattern defects on inner layers before lamination. Prevents costly multilayer scrap.
Flying Probe Electrical Test
ATG flying probe testers. Continuity and isolation on every net, no fixture needed. 6 machines for fast prototype and production turnaround.
Bed-of-Nails ICT
10 dedicated bed-of-nails test stations for high-volume PCB production. Custom fixture contacts every test point simultaneously. Test time under 3 seconds per board.
X-Ray Inspection
Non-destructive X-ray inspection for internal PCB defects - voids, delamination, drill registration. Sub-micron precision for multilayer verification.
Microsection Analysis
Cross-section analysis with Olympus microscope. Plating thickness, hole wall quality, inter-layer bonding. Destructive testing for process validation per IPC-6012.
Thermal Stress Test
288C solder float test per IPC-TM-650 verifies PCB resistance to assembly thermal shock. Pass/fail: no delamination or hole wall separation.
Solderability Test
Solderability test per IPC-J-STD-003 verifies surface finish wetting. Ensures perfect solder acceptance at your assembly line. Tests every finish type.
Ionic Contamination Test
ROSE testing per IPC-TM-650 2.3.25 measures residual ionic contamination. Ensures long-term reliability against corrosion and electrochemical migration.
Impedance TDR Test
TDR verifies controlled impedance accuracy on every production panel. +/-10% standard, +/-5% available. Critical for RF and high-speed digital.
Visual Final Inspection
40 inspection stations. Magnified visual check, dimensional verification, vacuum packaging. Every board to IPC-A-600 before shipment.
PCB Factory Tour
Step inside our PCB manufacturing facility - 200+ high-precision machines, from drilling to final inspection.
CNC Drilling Workshop
High-speed CNC drilling workshop: 150+ spindles including Taiwan Dongtai SD-62C 200,000 RPM (2 units). Mechanical drilling to 0.15mm, aspect ratio 20:1.
LDI & Imaging
xinuo LDI Automatic exposure machine S100807 (2台) for fine-line exposure. 2/2 mil trace/space. Laser direct writing eliminates film errors.
Factory Overview
Full PCB factory walkthrough: drilling to packaging. 200+ machines. See where your boards are made.
Laser Drill & HDI Bay
20 Mitsubishi laser drills for micro-via processing. Hole sizes to 0.1mm. Dedicated HDI production bay for smartphones and ADAS boards.
Surface Finish - ENIG Line
Atotech ENIG line. Electroless Nickel Immersion Gold - flat solderable finish for fine-pitch BGA, wire bonding. XRF verified.
Final Inspection & Packaging
40 inspection stations. Visual check under magnification, dimensional verification, vacuum-sealed packaging. Ready to ship.
Solder Mask & Silkscreen
LPI solder mask application, exposure, curing. Silkscreen legend for component identification. Pre-treatment of aerospace assembly for sandblasting ensures perfect adhesion.
Lamination & Press Area
CEDATE vacuum lamination presses + HuoQuan. Stack-up to 68 layers under precise temperature, pressure, and vacuum control.
Plating Line
Copper plating pretreatment for galvanized copper plating + Dongwei vertical continuous electroplating line (8 copper).Consistent thickness across all hole walls. Heavy copper supp
AOI & Electrical Testing
10 AOI stations + WTD flying probe + bed-of-nails fixtures. Every board optically and electrically tested before shipping.
Quality Standards We Follow
Every PCB is manufactured and inspected to these industry standards - no exceptions.
Lead-Free HASL / ENIG
RoHS-compliant lead-free HASL standard. ENIG per IPC-4552 for fine-pitch. Immersion Ag, Sn, OSP also available.
Impedance Control +/-10%
Controlled impedance +/-10% standard, +/-5% for demanding RF and high-speed designs. TDR-verified on every production panel.
IPC-A-600 Class 2/3
IPC-A-600 defines visual acceptance criteria for bare PCBs. Class 2 for industrial/commercial, Class 3 for aerospace, medical & military.
IPC-6012
IPC-6012 defines qualification and performance requirements for rigid PCBs: plating, etching, solder mask, tolerances.
IPC-TM-650 Test Methods
Industry-standard test methods per IPC-TM-650: thermal stress, solderability, ionic contamination, microsection, peel strength, impedance.
IPC-4101 Base Materials
IPC-4101 governs laminate and prepreg properties. Materials from Isola, Rogers, Taconic, Shengyi verified to IPC-4101 slash sheets.
ESD S20.20
Full ESD protection: grounded workstations, ionizers, conductive flooring, dissipative packaging. Every PCB handled in ESD-safe environment.
UL / RoHS / REACH
All PCB materials UL-recognized, RoHS-compliant (EU 2015/863), REACH-compliant. Material declarations and certificates with every order.