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AOI - Inner Layer

Catch Defects Before They Are Buried

An inner-layer defect caught before lamination costs a single core. The same defect buried inside a 12-layer board costs the entire panel. Every etched core is scanned against Gerber data. Shorts, opens, pattern deviations, and residual copper are flagged. Defective cores are repaired or scrapped before entering the lamination book. Detection resolution: 15um. Cycle time: under 30 seconds per side.