Can Your Board Survive Assembly?
A test coupon floats on molten solder at 288C for 10 seconds - simulating the most extreme assembly thermal conditions. After cooling, microsection inspection checks for delamination, hole wall pull-away, and pad lifting per IPC-TM-650 Method 2.6.8. This verifies that laminate, oxide, lamination, and plating will survive assembly without latent damage.
