Universe Solder Mask Blasting Pretreatment GL231108B1025A (1 unit)
A critical pretreatment process before solder mask coating. Through blasting + chemical treatment, the copper surface of the PCB is roughened and cleaned to enhance the adhesion between solder mask ink and the copper surface. Copper surfaces without adequate pretreatment will result in insufficient solder mask adhesion, leading to bubbles and delamination under subsequent thermal stress or actual usage. Equipment specification: Universe GL231108B1025A, 1 unit.
English
