Building Copper, Atom by Atom
Electroless copper creates a thin seed layer. Panel plating builds it to the required thickness - 20-25um in the hole barrel for standard PCBs, significantly more for heavy-copper designs. Our Dongwei vertical continuous plating line (8 copper) alongside Atotech and Schmid systems support copper thicknesses up to 10oz (350um) - essential for power electronics, bus bars, and high-
Pulse Plating for High-Aspect-Ratio Vias
DC plating at aspect ratios above 10:1 produces hourglass-shaped deposits - thick at the hole entrance, thin in the middle. Pulse plating alternates forward current pulses (deposit) with short reverse pulses (selectively dissolve high-current-density areas). Result: uniform barrel thickness throughout the hole. Used for aspect ratios above 12:1 and IPC-6012 Class 3 requirements.
