20 Mitsubishi Laser Drills
The HDI bay houses 20 Mitsubishi laser drills - CO2 and UV platforms - dedicated to micro-via formation. Laser pulses ablate dielectric directly above copper target pads, creating clean flat-bottomed blind vias as small as 0.1mm. Zero mechanical stress. Zero burrs. This bay produces any-layer HDI architectures for smartphones, ADAS processors, and 5G antenna boards.
