Dry Film Laminator

The Photographic Medium for Circuit Patterns

After inner-layer cores are cleaned, a photosensitive polymer film - dry film photoresist - is laminated onto both sides of the copper. This film is the photographic medium: exposed to UV light through artwork or LDI, developed to remove unexposed areas, then serving as etch resist protecting the copper circuit pattern during DES processing. Our Schmid and KCE laminators apply photoresist with thickness uniformity of +/-2um across 610x760mm panels in a Class 10,000 cleanroom environment.

Why Lamination Quality Determines Imaging Quality

Thickness variation produces inconsistent exposure - thick areas underexpose, thin areas overexpose and lose resolution. Poor adhesion allows developer to penetrate under resist edges, producing ragged traces and unpredictable line width. Particle contamination - any dust speck trapped between resist and copper blocks UV and creates an open circuit. Our horizontal lamination processes panels continuously through heated rollers; vertical lamination handles larger or thinner panels.