01
DFM Review
Engineering team checks your Gerber files before production starts 鈥?report in 24h.
PCB Production Process
02
Inner Layer Imaging
Dry film lamination 鈫?LDI exposure 鈫?develop 鈫?etch 鈫?strip for circuit formation.
03
AOI 鈥?Inner Layer
Automated optical inspection verifies inner layer patterns before lamination.
04
Oxide Treatment
Copper surface preparation for strong inter-layer bonding reliability.
05
Layup & Lamination
Stack cores + prepregs 鈫?heat & pressure 鈫?multilayer bonding up to 68 layers.
06
Drilling
CNC mechanical drill (0.15mm+) + laser micro-via (0.1mm) 鈥?aspect ratio up to 20:1.
07
Plasma Desmear
Cleans hole walls & activates PTFE/polyimide 鈥?essential for high-frequency materials.
08
Electroless Copper
Chemical copper deposition on hole walls 鈥?creates conductive base for electroplating.
09
Outer Layer Imaging
Same LDI process applied to outer copper 鈥?trace/space down to 2/2 mil.
10
Pattern Plating
Electrolytic copper plating + tin etch resist 鈥?builds trace thickness to spec.
11
Etching
Remove unwanted copper 鈥?leaving only the designed circuit pattern intact.
12
Solder Mask Application
LPI coating 鈫?exposure 鈫?development 鈫?thermal cure. Standard green, custom colors.
13
Surface Finish
ENIG / Lead-Free HASL / OSP / Immersion Silver / Immersion Tin 鈥?matched to your design.
14
Silkscreen Printing
Component reference designators, polarity marks, logos 鈥?white, black or yellow ink.
15
Electrical Test
Flying probe or bed-of-nails 鈥?100% net coverage: continuity & isolation verified.
16
Profiling
V-scoring or CNC routing to final board shape 鈥?clean edges, precise dimensions.
17
Final Inspection & Packing
Visual + dimensional check 鈫?vacuum sealed 鈫?labeled & ready to ship.
PCB workshop resources
PCB Manufacturing Equipment
CNC Drilling Machine
Mechanical drilling down to 0.15mm, aspect ratio up to 20:1. 150+ spindles across the workshop.
Laser Drill
Micro-via drilling for HDI boards, hole size down to 0.1mm. 20 machines for high-volume throughput.
Plasma Desmear
PTFE & polyimide hole wall activation for reliable plating. Essential for high-frequency RF materials.
Vacuum Lamination Press
Precision multilayer bonding with temperature & pressure control. Supports up to 68 layers.
Dry Film Laminator
Photoresist application for inner & outer layer imaging. Horizontal and vertical coating options.
LDI 鈥?Laser Direct Imaging
Fine-line exposure down to 2/2 mil trace/space. Eliminates film alignment errors for HDI precision.
DES Line
Develop-Etch-Strip for precise pattern formation. 3 dedicated lines for high throughput.
AOI 鈥?Inner Layer
Automated optical inspection before lamination. 10 AOI stations catch defects early to prevent scrap.
Oxide Treatment Line
Copper surface preparation 鈥?brown/black oxide for maximum bonding reliability between layers.
Electroless Copper Line
Chemical copper deposition for hole wall metallization 鈥?creates conductive base for electroplating.
Panel Plating Line
Electrolytic copper plating to target thickness. Heavy copper up to 10oz supported for power electronics.
Solder Mask LPI Line
Liquid photoimageable solder mask 鈥?apply, expose, develop, cure. Green, black, white, blue, red.
Silkscreen Printer
Legend printing 鈥?component IDs, polarity marks, logos. White, black, or yellow ink options.
ENIG Line
Electroless Nickel Immersion Gold 鈥?flat, solderable finish for fine-pitch BGA, wire bonding & press-fit.
Flying Probe Tester
Electrical test without custom fixture 鈥?100% net coverage. 6 machines for fast turnaround.
V-Scoring & Router
PCB profiling, depaneling & edge beveling. V-scoring for panelized boards, routing for complex shapes.
Final Inspection Station
Visual check, dimensional measurement, vacuum packaging. 40 inspection stations for thorough QC.
Quality Control & Testing
AOI 鈥?Inner Layer
Shorts, opens, pattern defects on inner layers detected before lamination 鈥?prevents costly scrap.
AOI 鈥?After Solder Mask
Final visual inspection after all processing 鈥?verifies solder mask coverage, pad alignment & legend quality.
Flying Probe Electrical Test
Continuity & isolation 鈥?every net tested, no custom fixture needed. Fast setup for prototypes.
Bed-of-Nails ICT
High-speed electrical test with custom fixture for volume production. 10 dedicated test stations.
X-Ray Inspection
Internal defect detection 鈥?voids, delamination, and drill registration verification with sub-micron precision.
Microsection Analysis
Cross-section cut to verify plating thickness, hole wall quality & inter-layer bonding with Olympus microscope.
Thermal Stress Test
288掳C solder float test 鈥?verifies resistance to assembly thermal shock. Pass/fail per IPC-TM-650.
Solderability Test
Verifies surface finish wetting performance 鈥?ensures perfect solderability at your assembly line.
Ionic Contamination Test
Measures residual ionic contamination per IPC standards 鈥?ensures long-term reliability against corrosion.
Impedance TDR Test
Time Domain Reflectometry verifies controlled impedance accuracy 鈥?critical for RF, high-speed & differential pairs.
Visual Final Inspection
Magnified visual check, dimensional measurement, packing verification 鈥?every board examined before shipment.
PCB Factory Tour
Step inside our PCB manufacturing facility 鈥?200+ high-precision machines, from drilling to final inspection.
Factory Overview
Full walkthrough: drilling 鈫?imaging 鈫?lamination 鈫?plating 鈫?solder mask 鈫?ENIG 鈫?testing 鈫?packaging.
CNC Drilling Workshop
High-speed CNC machines in operation. 150+ spindles, down to 0.15mm, aspect ratio up to 20:1.
Laser Drill & HDI Bay
20 Mitsubishi laser drills for micro-via processing. Hole sizes down to 0.1mm for any-layer HDI.
Lamination & Press Area
CEDATE vacuum presses + HuoQuan conventional presses. Stack-up up to 68 layers under precise control.
Plating Line
Electroless copper + electrolytic panel plating. Consistent thickness across all hole walls 鈥?up to 10oz copper.
LDI & Imaging
Orbotech Laser Direct Imaging for fine-line exposure. 2/2 mil trace/space 鈥?the precision behind HDI designs.
Solder Mask & Silkscreen
LPI solder mask application, exposure, curing. Followed by silkscreen legend for component ID and branding.
Surface Finish 鈥?ENIG Line
Electroless Nickel Immersion Gold. Flat, solderable finish for fine-pitch BGA, wire bonding & press-fit.
AOI & Electrical Testing
10 AOI stations + 6 flying probe testers + 10 bed-of-nails fixtures. Every board tested before shipping.
Final Inspection & Packaging
40 inspection stations 鈥?visual check under magnification, dimensional verification, vacuum sealing. Ready to ship.
Quality Standards We Follow
Every PCB is manufactured and inspected to these industry standards 鈥?no exceptions.
IPC-A-600 Class 2 / Class 3
Acceptability of Printed Boards 鈥?the definitive visual inspection standard. Class 2 for industrial/commercial, Class 3 for aerospace, medical & military where zero-defect is mandatory.
IPC-6012
Qualification and Performance Specification for Rigid Printed Boards 鈥?defines acceptance criteria for every PCB we ship, covering plating, etching, solder mask, and dimensional tolerances.
IPC-4101 Base Materials
Specification for Base Materials 鈥?governs laminate and prepreg properties. We use materials from Isola, Rogers, Taconic, and Shengyi, each verified to IPC-4101 slash sheets.
Impedance Control 卤10%
Controlled impedance with 卤10% tolerance as standard, 卤5% available for demanding RF and high-speed digital designs. TDR-verified on every production panel.
Lead-Free HASL / ENIG
RoHS-compliant lead-free HASL as standard. ENIG (per IPC-4552) for fine-pitch, BGA, and wire bonding applications. Immersion Silver, Immersion Tin, and OSP also available.
ESD S20.20
Full electrostatic discharge control 鈥?grounded workstations, ionizers, conductive flooring, dissipative packaging. Every PCB handled in ESD-safe environment from start to finish.
IPC-TM-650 Test Methods
Industry-standard test methodology for thermal stress, solderability, ionic contamination, microsection, peel strength, and impedance. All QC testing follows IPC-TM-650 procedures.
UL / RoHS / REACH
All PCB materials are UL-recognized, RoHS-compliant (EU 2015/863), and REACH-compliant. Full material declaration and certificates of compliance provided with every order.