6 layer UltraThin HDI Camera Board 6-layer ultra-thin HDI camera board by Superb Automation. 0.6mm finished thickness, 3/3mil trace/space, 4mil laser blind vias, ENIG finish, FR4 Tg≥150°C substrate. Optimized for MIPI D-PHY/C-PHY at 2.5Gbps/lane with <0.2dB/mm insertion loss at 3GHz.
18-Layer TU883 2oz ENIG PCB for High-Current Power Distribution Backplane 18-Layer 2nd-Order HDI · 2oz Thick Copper · TU883 · 2.6mm · ENIG; High-Current Power Distribution Backplane