Heavy Copper / High-Thermal PCB Fabrication

Heavy copper PCB manufacturing — 16 layers · 5 oz inner copper · 3.75 mm · Press-fit ±0.05 mm · Resin plug · Blind via · Build-to-print from Gerber files

Capabilities

Process Highlights

Heavy Copper Plating

• 5 oz (175 μm) inner-layer copper — etched from thick-clad laminate

• Outer-layer build-up via pattern plating — up to 12 oz finished

• Pulse-reverse plating — uniform copper distribution across high-aspect-ratio traces

• Etch compensation — trace width adjusted for lateral etch on thick copper

Press-Fit Hole

• Drill-to-plate tolerance ± 0.05 mm — compliant with IEC 60352-5 press-fit standard

• Dedicated press-fit drill bit library — diameter-specific tooling

• Post-plating hole diameter verified per lot — statistical process control

• Press-fit zones for IGBT modules, power connectors, busbar interfaces

Resin Plug

• Via filling — conductive (copper-filled) and non-conductive (epoxy-filled)

• Planarization after plugging — flat surface for via-in-pad BGA landings

• Vacuum-assisted fill — void-free, < 2% void rate per X-ray inspection

Blind Via

• Laser-drilled blind vias through outer dielectric to inner copper layers

• Copper-filled or plated-through — via-in-pad compatible

• Sequential lamination — blind via layers built up before final press

Thermal Management

• Thick copper planes as heat spreaders — 5 oz inner layers conduct heat laterally

• Thermal vias — array of plated through-holes under hot components

• Copper coin / embedded copper — pressed into cavity for direct die-attach cooling

• Metal-core (aluminum / copper base) — optional for single-sided power boards

Applications

• IGBT module — press-fit holes for IGBT pins · 5 oz copper for high-current bus

• Power supply — server PSU, industrial rectifier, high-current DC-DC converter

• Automotive — EV traction inverter, BMS, on-board charger, DC fast-charge

• Industrial motor drive — VFD, servo drive, soft starter

• Renewable energy — solar inverter, wind turbine converter, energy storage PCS

• LED — high-power LED array, UV curing lamp

Why Heavy Copper

• 5 oz copper carries high current — reduces I²R loss and voltage drop across the board

• Thick copper planes spread heat — lower thermal resistance, less need for external heatsinks

• Press-fit eliminates soldering — field-replaceable connectors, no thermal stress on assembly

• One heavy-copper board replaces a busbar + PCB assembly — fewer parts, higher reliability

• Resin plug + planarization enables via-in-pad under fine-pitch BGA on thick copper