Automotive Telematics PCB Manufacturer — HDI & RF PCB for GPS Tracker, CAN Bus & IoT
From 4-layer GNSS tracker boards to 12-layer ADAS camera HDI stacks, Superb Automation fabricates PCBs for telematics, vehicle electronics, and industrial IoT. Our PCB capabilities cover the full range: Rogers RF laminates for GPS/cellular front-ends, high-Tg FR4 for under-hood CAN modules, HDI microvias for miniature asset trackers, and hybrid stacks for multi-radio IoT gateways. 1–68 layers, prototype to 50K/month volume.
Product Specifications
Automotive Telematics PCB Manufacturer — HDI & RF PCB for GPS Tracker, CAN Bus & IoT
From 4-layer GNSS tracker boards to 12-layer ADAS camera HDI stacks, Superb Automation fabricates PCBs for telematics, vehicle electronics, and industrial IoT. Our PCB capabilities cover the full range: Rogers RF laminates for GPS/cellular front-ends, high-Tg FR4 for under-hood CAN modules, HDI microvias for miniature asset trackers, and hybrid stacks for multi-radio IoT gateways. 1–68 layers, prototype to 50K/month volume.
PCB Solutions for Automotive Telematics & IoT Applications
Superb Automation provides customized PCB manufacturing for automotive telematics, intelligent vehicle electronics, and industrial IoT. Our PCB fabrication supports GPS tracking devices (StarLink Tracker, Asset, EV, Scout), CAN bus interface modules (eCAN/MagiCAN), ADAS camera systems (eEye AI Camera), and wireless IoT sensor products (TagLINK Bridge, SMART MS, IoTLINK Shadow, IoTLINK Pack).
Unlike general-purpose PCB shops, we understand the specific demands of each device category: a Starlink EV tracker needs 6-layer Rogers+FR4 with controlled-impedance GNSS traces; an eCAN module needs automotive-grade 4-layer high-Tg FR4 with CAN transceiver isolation; a TagLINK BLE tag needs 4-layer HDI with 0201 passives and nA-level leakage control. One PCB supplier, all three categories.
PCB Requirements for Telematics & Vehicle Electronics
| PCB Requirement | Superb PCB Solution |
| GNSS / LTE / BLE RF Sections | Rogers RO4350B / RO4003C RF laminates, 50Ω single-ended impedance control (±5%), via fencing for LNA isolation, hybrid Rogers+FR4 stackup |
| Compact / Miniaturized Design | HDI PCB with laser-drilled microvias (0.1mm), 2+N+2 to 4+N+4 stackup, 0.3mm BGA pitch support, 0201 passive land pattern |
| Automotive Environment Reliability | High-Tg FR4 (TG170+, TG180 available), IPC-A-600 Class 2/3 acceptance, -40°C to +125°C operating range, thermal cycling qualified |
| Low-Power IoT / Battery Devices | Ultra-clean PCB surface finish (ENIG), low-leakage laminate selection, optimized copper pour for minimal parasitic draw |
| Multi-Radio Coexistence | Dedicated ground planes per RF domain, internal shielding, antenna keep-out zone enforcement, desense-aware layout review |
| High-Speed Digital (MIPI, DDR, USB 3.0) | 100Ω differential pair impedance control, ±5mil intra-pair length matching, low-Dk materials (Megtron 4/6, TU-883), backdrill for stub reduction |
| CAN Bus / Vehicle Interface | Wide-input power section with creepage/clearance, TVS/ESD protection footprint, J1939/OBD-II connector through-hole reliability |
PCB Layer Structure for Telematics & IoT Devices
| PCB Type | Typical Use | Layer Count | Material Recommendation |
| Basic GPS Tracker | 2G/4G Cat-1 tracker, OBD-II plug-in, simple fleet device | 4–6 layers | FR4 High-Tg 170, optional Rogers RO4350B L1 for GNSS |
| Advanced Fleet Tracker | 4G Cat-4 + Wi-Fi + BLE + CAN, Starlink EV class | 6–8 layers | Hybrid Rogers RO4350B (L1/L2) + FR4 High-Tg (L3-L8) |
| ADAS Camera Module | eEye AI Camera, DMS, fleet safety camera | 8–12 layers | Megtron 6 or TU-883, HDI 2+N+2, 0.4mm BGA pitch |
| CAN Bus Interface Module | eCAN/MagiCAN, J1939 gateway, vehicle data logger | 4–6 layers | FR4 High-Tg 180, 2oz copper for power, IPC Class 3 |
| BLE Sensor Tag / Asset Tracker | TagLINK Bridge, coin-cell tracker, BLE beacon | 2–4 layers | FR4 or flexible polyimide, ENIG surface finish |
| Multi-Radio IoT Gateway | SMART MS, IoTLINK Pack, LoRa+BLE+Wi-Fi+GNSS | 8–12 layers | Rogers RO4350B + FR4 hybrid, dedicated RF ground planes |
HDI PCB for Miniature Trackers & Wireless IoT
When board real estate shrinks — think coin-cell BLE tags, OBD-II plug-in trackers, and wearable IoT sensors — HDI technology becomes essential. Superb Automation's HDI PCB capabilities include:
Laser-drilled microvias — 0.1mm (4mil) diameter, enabling 0.4mm BGA fanout and 0201 passive placement
2+N+2 to 4+N+4 stackup — staggered and stacked microvias for maximum routing density in minimal layer count
Any-layer HDI (ALIVH) — for ultra-compact designs where every layer has microvia interconnect
Via-in-pad / filled via — conductive or non-conductive epoxy fill with planarized surface for BGA land pads
Fine line/space — 2.5/2.5mil trace/space for high-density breakout routing
ENIG + ENEPIG surface finish — flat, solderable, and wire-bondable; standard for HDI designs
Long-tail queries covered: HDI PCB for GPS tracker, microvia PCB vehicle tracking, 4+N+4 HDI IoT sensor, fine pitch BGA PCB telematics, any-layer HDI manufacturer automotive
RF PCB Design for GNSS, LTE & Wireless Communication
Every telematics device has at least one radio — most have three or four. GPS L1 (1575.42 MHz), LTE B2/B4/B5/B12 (700–2100 MHz), BLE 2.4 GHz, Wi-Fi 2.4/5 GHz — all on one board. The PCB must keep these signals clean and isolated. Superb's RF PCB manufacturing includes:
50Ω single-ended impedance control — ±5% tolerance (standard: ±10%), critical for GNSS front-end LNA-to-SAW matching
100Ω differential impedance — for MIPI CSI camera lanes, USB 3.0, and LVDS display interfaces
Rogers RF laminates — RO4003C (Dk 3.38), RO4350B (Dk 3.48), RO3003 (Dk 3.00 for mmWave), RO4835 (Dk 3.48, oxidation-resistant)
Hybrid stackup — Rogers RF layer(s) bonded to FR4 digital layers with low-loss prepreg (RO4450F, 3.52 Dk)
Ground via fencing — λ/20 via spacing along GNSS traces to suppress parallel-plate mode coupling
Antenna matching network footprint — pi-network topology with 0402 component land pattern for post-fabrication tuning
Low-loss materials for mmWave — Isola Astra MT77 (Dk 3.0), Megtron 7 for 77GHz ADAS radar applications
Long-tail queries covered: Rogers RO4350B PCB manufacturer, 50 ohm controlled impedance PCB telematics, hybrid Rogers FR4 PCB stackup, GNSS RF PCB fabrication, low-loss PCB material for 5.8GHz, antenna matching network PCB design
PCB Application Examples — From StarLink to IoTLINK
GPS Telematics — StarLink Series
StarLink Tracker, StarLink Asset, StarLink EV, StarLink Scout — vehicle tracking, fleet management, stolen vehicle recovery, and EV monitoring. PCB requirements converge on compact multilayer with Rogers RF for GNSS+LTE, high-Tg FR4 for under-dash thermal cycling, and 4–6 layer stackup with dedicated power/ground planes. ENIG surface finish recommended for corrosion resistance in humid vehicle environments.
ADAS Camera — eEye AI Camera System
AI-based driver monitoring and fleet safety cameras demand 8–12 layer HDI with Megtron 6 or TU-883 low-Dk material for MIPI CSI-2 high-speed differential pairs. 100Ω impedance control, ±5mil intra-pair skew, and 0.4mm BGA fanout for image sensor packages. Flex or rigid-flex interconnect for camera-to-mainboard connection with dynamic bend reliability.
CAN Bus Module — eCAN / MagiCAN
Vehicle data collection and diagnostics modules need automotive-grade 4–6 layer FR4 High-Tg 180 with CAN transceiver isolation, wide-input power supply section (6V–36V load dump protection), and J1939/OBD-II connector through-hole reliability. IPC Class 3 acceptance criteria for zero-field-failure requirements in fleet deployment.
IoT Sensors — TagLINK, IoTLINK, SMART MS
TagLINK Bridge (BLE tag), SMART MS Wireless Multi-Sensor (BLE+LoRa+Wi-Fi), IoTLINK Shadow/Pack (asset tracker) — these devices span 2-layer flexible PCBs to 12-layer multi-radio HDI stacks. Common requirements: ENIG surface finish for low contact resistance, ultra-clean fabrication for nA-level sleep current, and 0201 component land patterns for maximum miniaturization.
Superb PCB Manufacturing Capabilities
| Capability | Specification |
| Layer Count | 1–68 layers (Wuxi: 128L max, Huizhou: 68L max) |
| HDI Technology | 1+N+1 to 4+N+4, laser-drilled microvias (0.1mm), stacked/staggered, any-layer |
| Min Trace/Space | 2.5/2.5mil (HDI), 3/3mil (standard multilayer) |
| Min Mechanical Drill | 0.15mm (6mil) |
| Impedance Control | 50Ω single-ended (±5%), 100Ω differential (±5%), TDR test report included |
| RF Materials (In Stock) | Rogers RO4003C, RO4350B, RO3003, RO4835; Taconic RF-35, TRF-45; Isola Astra MT77; Megtron 4/6/7; TU-883, TU-872 SLK |
| Base Materials | FR4 Standard Tg 130–140, High-Tg 170–180, halogen-free FR4, polyimide flex, PTFE |
| Copper Weight | 0.5oz–10oz (inner/outer), 2oz+ for power/automotive applications |
| Surface Finish | ENIG (standard), ENEPIG, immersion silver, immersion tin, OSP, HASL, hard gold |
| Solder Mask | Green, blue, black, red, white, yellow; matte or glossy; LPI photoimageable |
| Quality Standards | IPC-A-600 Class 2/3, IPC-6012, ISO 9001, UL (E354912) |
| Testing | 100% AOI, flying probe, impedance TDR, microsection analysis, thermal stress, solderability test |
| Order Quantity | 5–100 pcs (prototype), 1K–50K+/month (volume production) |
| Lead Time | Standard 5–8 working days, expedited 2–3 days (prototype); 2–4 weeks (production) |
Why Choose Superb Automation for Telematics PCB
Telematics PCB Experience
We've fabricated PCBs for GPS trackers, CAN bus modules, ADAS cameras, and multi-radio IoT gateways. We know the Rogers+FR4 hybrid stackup for GNSS+LTE boards and the Megtron stackup for MIPI CSI camera modules.
Rogers & RF Materials In Stock
RO4003C, RO4350B, RO3003, RO4835, Taconic RF-35, Isola Astra MT77 — stocked in standard thicknesses (0.020", 0.030", 0.060"). No 3-week material lead time delays.
Full Stack: PCB + PCBA + Components
Get your GPS tracker PCBs fabricated, assembled with u-blox/STM32/Quectel components, and functionally tested — all from one supplier. No multi-vendor coordination.
DFM Review Included
Before production, our engineers review your Gerbers for: antenna keep-out violations, impedance stackup optimization, via fencing adequacy, thermal relief for RF connectors, and test point accessibility.
IPC Class 3 Qualified
For ADAS cameras, under-hood CAN modules, and safety-critical telematics — we routinely ship IPC-A-600 Class 3 boards with microsection reports and full traceability.
Prototype to 50K/Month
Start with 5 prototype PCBs for NPI validation. Scale to 50,000+ boards/month across two factories (Wuxi 128L, Huizhou 68L). Same process, same quality, same supplier.
Frequently Asked Questions
What PCB material is best for a GPS tracker with GNSS + LTE?
For cost-sensitive trackers, FR4 High-Tg 170 with controlled-impedance traces works for 4-layer designs. For better RF performance — especially if you're seeing cold-start TTFF issues or poor C/N0 — use a Rogers RO4350B top layer bonded to FR4 core (hybrid stackup). The Rogers layer carries the GNSS LNA, SAW filter, and antenna feed; FR4 handles digital and power. This is our standard recommendation for Starlink-class trackers.
How many layers do I need for an ADAS camera PCB?
8–12 layers is typical for an ADAS camera module with a MIPI CSI-2 image sensor, DDR memory, and processor. The MIPI differential pairs need 100Ω impedance control on a low-Dk material (Megtron 6 or TU-883). If you're combining the camera with a DMS IR illuminator on the same board, budget 10–12 layers with a dedicated power plane for the IR LED driver. HDI with laser microvias is usually required for the 0.4–0.5mm pitch image sensor BGA.
What is the minimum order quantity for telematics PCB prototypes?
5 pieces minimum for prototype orders. Standard lead time is 5–8 working days; expedited is 2–3 working days. We accept Gerber RS-274X files plus a fabrication drawing (PDF is fine). For RF boards, include a stackup table and impedance requirements — our CAM engineer will verify and suggest optimizations before fabrication.
Do you offer impedance test reports with every order?
Yes — TDR impedance test reports are included at no extra charge for any board with controlled-impedance traces. We test on production coupons (not on the actual board) per IPC-TM-650. Each report shows measured impedance values, tolerance, and pass/fail per trace group. ±5% tolerance is our standard; ±10% is the industry default.
Can you do rigid-flex PCB for camera-to-mainboard interconnects?
Yes — rigid-flex and flex PCBs with polyimide core, 2–12 layers, with stiffeners as needed. We've fabricated flex interconnects for ADAS camera modules where the image sensor sits on a rigid section and the connector is on a flex tail. Dynamic bend testing and impedance control across the rigid-flex transition are standard.
What surface finish do you recommend for IoT sensor PCBs?
ENIG (electroless nickel immersion gold) is our standard recommendation for IoT sensors and battery-powered devices. It provides a flat, solderable surface for 0201 passives and fine-pitch BGAs, with excellent shelf life and low contact resistance. For outdoor/vehicle devices that will be conformally coated, ENIG is preferred — it bonds well with acrylic and silicone coatings. ENEPIG is available for wire-bonding applications.
Do you review Gerber files for DFM issues before fabrication?
Yes — DFM review is standard, not optional. Every order goes through CAM engineering review before fabrication. We check: impedance stackup feasibility, via fencing adequacy for RF traces, solder mask clearance for fine-pitch components, copper balance across layers, annular ring violations, acid traps, and silkscreen legibility. You receive a DFM report with flagged issues and suggested fixes before we cut any copper.
Send your Gerber files and fabrication requirements to pcba@superb-tech.com. Include your device type (GPS tracker, ADAS camera, CAN bus module, or IoT sensor) for priority routing. We respond with a stackup review, DFM feedback, and quotation within 1 business day.
Superb Automation Co., Limited · From Design to Delivery · www.superb-tech.com