Memory IC Package Substrate PCB Solution
Product Specifications
Memory IC Package Substrate PCB Solution
Product Overview
SUPERB provides advanced Memory IC Package Substrate PCB solutions for UDPQFN and memory wafer packaging applications.
The product series adopts conventional die bonding technology with gold wire and aluminum wire bonding, combined with black epoxy molding compound encapsulation to provide reliable mechanical protection and stable electrical performance for memory semiconductor packages.
Using BT and HTG170 substrate materials, SUPERB supports ultra-thin package substrates with a finished board thickness of 0.2–0.3 mm, 0.05 mm line width and spacing, and a minimum bonding pad size of 0.06 mm.
The solution is designed for customers requiring compact, high-density, and reliable package substrates for memory IC and UDPQFN semiconductor applications.
Key Specifications
| Item | Capability |
|---|---|
| Product Type | Memory IC Package Substrate PCB |
| Package Application | UDPQFN, Memory Wafer Packaging |
| Bonding Technology | Conventional Die Bonding |
| Wire Bonding | Gold Wire / Aluminum Wire |
| Encapsulation | Black Epoxy Molding Compound |
| Material | BT, HTG170 |
| Finished Board Thickness | 0.2 – 0.3 mm |
| Minimum Hole | 0.10 – 0.15 mm |
| Line Width / Spacing | 0.05 mm / 0.05 mm |
| Minimum Bonding Pad | 0.06 mm |
| Solder Mask Process | Planarization Process |
Product Applications
UDPQFN Package Substrate
Compact Package Substrate for UDPQFN Devices
SUPERB provides thin BT-based package substrates designed for UDPQFN semiconductor packaging, supporting compact package structures and high-density circuit routing.
UDPQFN package applications
Memory-related semiconductor devices
Compact IC packaging
High-density electronic modules
Memory Wafer Packaging
Reliable Substrate for Memory Semiconductor Packaging
The Memory Series supports semiconductor packaging applications using conventional die bonding and wire bonding technology.
The substrate is designed to provide stable mechanical support and reliable electrical interconnection for memory wafer packaging.
Memory IC packaging
Memory wafer applications
Storage semiconductor devices
Embedded memory modules
Product Features
Ultra-Thin Memory Package Substrate
With a finished board thickness of only 0.2–0.3 mm, the substrate is optimized for compact semiconductor package structures where space and package height are critical.
Key Advantages
0.2–0.3 mm ultra-thin finished thickness
0.05 mm line width and spacing
0.10–0.15 mm minimum hole
0.06 mm minimum bonding pad
Compact package structure
High-density circuit routing capability
Conventional Die Bonding & Wire Bonding
The Memory Series adopts conventional die attach bonding technology combined with gold wire and aluminum wire bonding.
Bonding Advantages
Stable die attachment
Reliable wire bonding
Suitable for memory semiconductor packaging
Controlled bonding pad dimensions
Consistent package assembly performance
BT & HTG170 Material System
SUPERB supports BT and HTG170 substrate materials for memory IC package applications.
Material Advantages
Suitable for semiconductor package substrates
Good thermal stability
Reliable mechanical strength
Stable electrical performance
Suitable for ultra-thin package structures
Black Epoxy Molding Encapsulation
The package adopts black epoxy molding compound encapsulation to provide protection for the semiconductor die and wire bonding structure.
Encapsulation Benefits
Protects the die and bonding wires
Improves mechanical protection
Provides stable package structure
Supports reliable semiconductor packaging
Advanced Manufacturing Process
1. Precision Die Bonding
The semiconductor die is accurately attached to the substrate using a controlled die bonding process. This provides stable mechanical positioning and reliable contact between the die and package substrate.
2. Gold Wire & Aluminum Wire Bonding
SUPERB supports both gold wire and aluminum wire bonding processes according to package and application requirements.
Precision bonding pad formation
Fine-pitch bonding support
Stable wire bonding
Consistent bonding quality
3. Black Epoxy Molding
After die and wire bonding, black epoxy molding compound is applied to encapsulate and protect the semiconductor package structure.
This process helps provide mechanical protection and long-term package reliability.
4. Solder Mask Planarization
The solder mask adopts a planarization process to improve surface flatness and dimensional consistency.
Improved surface flatness
Better pad definition
Stable package assembly
Improved manufacturing consistency
Technical Capabilities
SUPERB integrates precision PCB substrate fabrication and semiconductor packaging technologies to provide customized Memory IC package substrate solutions.
UDPQFN package substrate fabrication
Memory IC package substrate manufacturing
BT and HTG170 material processing
Ultra-thin substrate fabrication
Fine-line circuit formation
Precision bonding pad fabrication
Gold wire bonding support
Aluminum wire bonding support
Black epoxy molding encapsulation
Solder mask planarization
Prototype and mass production support
Why Choose SUPERB for Memory Package Substrates?
1. Ultra-Thin Package Substrate Capability
Finished board thickness from 0.2–0.3 mm for compact semiconductor package designs.
2. Fine-Line Circuit Technology
Supports 0.05 mm line width and spacing for high-density package routing.
3. Flexible Bonding Technology
Supports conventional die bonding with gold wire and aluminum wire bonding.
4. Multiple Substrate Materials
BT and HTG170 material options are available for different semiconductor packaging requirements.
5. Integrated Packaging Process Support
Supports die bonding, wire bonding, black epoxy molding, and solder mask planarization requirements.
Request a Quote
Contact SUPERB for customized Memory IC Package Substrate PCB solutions.
Please provide the following information:
Package type
Substrate material
Layer count
Board thickness
Bonding requirements
Wire bonding type
Package dimensions
Required quantity
Our engineering team will provide professional technical support and quotation based on your requirements.
Email: info@superb-tech.com
WhatsApp: +86 13396081443
Website: www.superb-tech.com