Multilayer High-Speed IC Package Substrate PCB
SUPERB provides advanced multilayer high-speed IC package substrate PCB solutions for 5G RF antenna modules, main-frequency power modules and high-frequency processor IC packaging. Featuring multi-layer, multi-step any-layer interconnection technology with Rogers and Panasonic high-performance materials, our substrates enable high-density signal transmission, superior high-frequency performance and reliable semiconductor packaging.
Product Specifications
IC Package Substrate
Multilayer High-Speed IC Package Substrate PCB Solution
SUPERB provides advanced multilayer high-speed IC package substrate PCB solutions for 5G RF antenna modules, main-frequency power modules and high-frequency processor IC packaging. Featuring multi-layer, multi-step any-layer interconnection technology with Rogers and Panasonic high-performance materials, our substrates enable high-density signal transmission, superior high-frequency performance and reliable semiconductor packaging.
0.03 mm
Line Width / Spacing
0.05 mm
Min. Hole (Laser)
0.04 mm
Min. Bonding Pitch
0.3 – 2.0 mm
Board Thickness
Product Applications
Multilayer high-speed product series — engineered for high-frequency and power semiconductor packaging.
5G RF
5G RF antenna modules
Low-loss Rogers / Panasonic materials for mmWave and sub-6 GHz antenna-in-package.
Power
Main-frequency power modules
High-thermal, high-current substrate for power management and DC-DC modules.
CPU / IC
Processor IC packages
High-density any-layer routing for CPU and high-speed processor packages.
Control IC
High-frequency control IC
Stable signal integrity for high-frequency control and driver IC packaging.
Automotive
Automotive semiconductor modules
Reliable substrate for automotive radar and power electronics.
Industrial
Industrial electronic chip packaging
Robust substrate for industrial control and power devices.
Product Features
Multi-layer, multi-step any-layer interconnection for high-speed signal transmission.
Feature 1
Multi-Layer High-Speed Substrate
SUPERB supports advanced multi-layer high-speed IC substrate designs with multi-step any-layer interconnection capability.
Multi-layer, multi-step any-layer interconnection
High-density signal transmission
Fine pitch BGA package support
High reliability for high-frequency applications
Feature 2
High-Performance Materials
Material: Rogers & Panasonic (MEGTRON series)
Advantages:
Low dielectric loss for high-frequency signal integrity
High dimensional stability
Excellent thermal performance
Reliable electrical performance
Material lineup:
Rogers — RO4003C, RO4350B
Panasonic — MEGTRON 6, MEGTRON 7
Technical Capability
Precision semiconductor-grade fabrication for high-speed IC substrates.
| Item | Capability |
|---|---|
| Substrate Type | Multilayer High-Speed IC Package Substrate |
| Product Series | 5G RF Antenna, Main-Frequency Power Module |
| Interconnection | Multi-layer, Multi-step Any-Layer Interconnection |
| Material | Rogers, Panasonic (MEGTRON) |
| Board Thickness | 0.3 – 2.0 mm |
| Minimum Hole | 0.05 mm |
| Via Technology | Laser drilling + Copper Filling / Mechanical drilling + Resin Plugging + Back Drilling |
| Line Width / Spacing | 0.03 mm / 0.03 mm |
| Minimum Bonding Pitch | 0.04 mm |
| Minimum BGA Pitch | 0.05 mm |
Advanced Process Capabilities
SUPERB high-speed IC substrate solutions integrate precision semiconductor-grade process technologies.
Process 1
Laser micro via drilling
0.05 mm laser-drilled micro vias with copper electroplating filling.
Process 2
Mechanical drilling + resin plugging + back drilling
High-aspect through holes with resin plug and back drilling for signal integrity.
Process 3
Fine line circuit formation
0.03 mm line width and spacing for high-density routing.
Process 4
Any-layer build-up technology
Multi-step any-layer interconnection for maximum routing density.
Process 5
High precision surface treatment
Fine bonding and BGA pad finishes for reliable die attach and assembly.
These technologies ensure:
✓
High-density interconnection
✓
Stable high-frequency electrical performance
✓
Reliable semiconductor packaging
Why Choose SUPERB as Your IC Package Substrate Partner?
Our goal is to help customers reduce sourcing complexity by providing reliable high-speed semiconductor packaging PCB solutions.
1
High-Speed IC Package Substrate PCB sourcing solution
2
Rogers & Panasonic high-frequency material expertise
3
Customized substrate design capability
4
Small-volume to high-volume support
5
Global component and PCB supply chain integration
Request a Quote
Send your IC package substrate requirements — substrate type, material, layer count and BGA pitch — for a same-day quotation.
Email
info@superb-tech.com
WhatsApp
+8613396081443
Website
www.superb-tech.com