Rigid-Flex / Flex PCB Fabrication

Rigid-flex PCB manufacturing — 14 layers · 10 rigid + 4 flex · 2+2 split · 2.2 mm · Panasonic · 3 mil line · Lead-free HASL · Build-to-print from Gerber files

Capabilities

Process Highlights

2+2 Split Flex Stack-Up

• Two independent 2-layer flex sub-stacks — flexible routing on four flex layers

• Each 2-layer sub-stack: 0.2 mm polyimide core with rolled-annealed copper

• Sub-stacks bonded into rigid section during single-press lamination

• Reduced bend radius vs. a single 4-layer flex — better dynamic flex durability

Panasonic Material System

• Rigid: Panasonic high-Tg FR-4 — Tg > 170 °C, low Z-axis CTE

• Flex: Panasonic polyimide film — high elongation, flex-cycle endurance > 100k cycles

• Single-supplier material stack — matched CTE between rigid and flex zones

• No-mix adhesive system — consistent bond strength across rigid-flex boundary

Fine-Line 3 mil / 3 mil

• 0.076 mm line and space — Laser Direct Imaging (LDI) for both rigid and flex layers

• Acid-etch process tuned for thin copper — 3 mil traces on ⅓ oz base copper

• AOI at 2 μm resolution — 100% trace inspection on all 14 layers

Flex-to-Rigid Transition

• Coverlay opening at flex bend zone — polyimide coverlay or photo-imageable coverlay

• Stiffener attachment at rigid-flex boundary — FR-4 or polyimide stiffener

• No-flow prepreg at transition — prevents resin bleed into flex area

• 100% electrical test — flying probe, including flex-tail continuity

Applications

• Aerospace — avionics interconnect, satellite hinge harness, phased-array fold

• Medical — endoscopy imaging head, implantable device flex interconnect

• Automotive — ADAS camera fold, LiDAR rotary coupling, EV BMS flex harness

• Industrial — robotic joint flex, foldable HMI, test-socket flex interconnect

• Consumer — foldable smartphone hinge PCB, wearable flex band

Why Rigid-Flex

• 2+2 split flex replaces cables and connectors — fewer assembly steps, fewer failure points

• Panasonic single-supplier stack — matched material behavior across thermal cycling

• 3 mil fine-line on flex — high-density routing in tight bend zones

• 3D packaging — folds into compact enclosures, eliminates rigid-to-rigid interconnects

• Lead-free HASL — RoHS compliant, compatible with lead-free assembly processes