STM8L151G6U6
Brand: ST
The STM8L151G6U6 is the memory-upgraded variant in the UFQFPN-28 form factor — providing 32 KB Flash (vs. 16 KB on the G4) while retaining all other specifications. This makes it the go-to choice when a drone BMS or sensor node firmware has outgrown the G4's Flash budget but must maintain the same PCB layout and mechanical dimensions.
The additional 16 KB Flash enables a dual-bank firmware architecture: the active firmware runs from one 16 KB bank while an OTA (Over-The-Air) update is received into the second bank via BLE/LoRa — enabling safe, brick-proof field updates for deployed drone sensor nodes. For BMS applications, the extra Flash accommodates more sophisticated SOH (State of Health) algorithms that track capacity fade, internal resistance growth, and cycle-life prediction over the battery's lifetime.
Product Specifications
STM8L151G6U6 — 32 KB Flash Ultra-Low-Power STM8L MCU in UFQFPN-28 with DMA for Advanced Drone BMS Nodes
The STM8L151G6U6 is the 32 KB Flash variant of the STM8L151 family in the same ultra-compact UFQFPN-28 (4×4 mm) package — doubling the Flash (32 KB vs. 16 KB on the G4) while retaining 2 KB SRAM, 1 KB EEPROM, 4-channel DMA, 12-bit ADC/DAC, and 0.35 µA Halt mode. This memory upgrade enables dual-bank firmware updates, extended sensor calibration storage, and richer BMS firmware with battery health (SOH) algorithms — all in the same tiny footprint as the G4 variant. Pin-compatible with STM8L151G4U6 for seamless memory upgrades.
Part Number Decoded — Field by Field
| Field | Value | Meaning |
|---|---|---|
| STM8 | Product Family | STMicroelectronics 8-bit MCU |
| L | Product Type | Ultra-Low-Power |
| 151 | Sub-Family | STM8L151 — DMA + large EEPROM |
| G | Pin Count | 28 pins (UFQFPN-28) |
| 6 | Flash Size | 32 KB |
| U | Package | UFQFPN |
| 6 | Temperature Range | −40°C to +85°C |
Quick Specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Part Number | STM8L151G6U6 |
| Core | STM8 (8-bit, 16 MHz) |
| Flash / SRAM / EEPROM | 32 KB / 2 KB / 1 KB |
| Package | UFQFPN-28 (4×4 mm, 0.5 mm pitch) |
| Supply Voltage | 1.8V – 3.6V |
| Temperature | −40°C to +85°C |
| GPIO / ADC / DAC / DMA | 26 / 12-bit 18-ch / 12-bit / 4-ch |
| Communication | 2× USART, 1× SPI, 1× I²C |
| Power | 0.35 µA Halt, 175 µA/MHz Run |
| Debug | SWIM |
Product Overview
The STM8L151G6U6 is the memory-upgraded variant in the UFQFPN-28 form factor — providing 32 KB Flash (vs. 16 KB on the G4) while retaining all other specifications. This makes it the go-to choice when a drone BMS or sensor node firmware has outgrown the G4's Flash budget but must maintain the same PCB layout and mechanical dimensions.
The additional 16 KB Flash enables a dual-bank firmware architecture: the active firmware runs from one 16 KB bank while an OTA (Over-The-Air) update is received into the second bank via BLE/LoRa — enabling safe, brick-proof field updates for deployed drone sensor nodes. For BMS applications, the extra Flash accommodates more sophisticated SOH (State of Health) algorithms that track capacity fade, internal resistance growth, and cycle-life prediction over the battery's lifetime.
Key Features & Benefits
32 KB Flash — Dual-Bank Firmware for Safe OTA Updates
Partition 32 KB into two 16 KB banks: one bank runs the active application while the other receives a firmware update wirelessly. If the update fails, the device falls back to the known-good bank — eliminating brick risk for deployed drone sensor nodes and BMS monitors.
Pin-Compatible with STM8L151G4U6 — No PCB Changes
The G6 shares the identical UFQFPN-28 pinout with the G4. An existing G4-based design can be upgraded to the G6 for double the Flash with zero PCB layout changes — only a BOM line-item update and firmware recompilation for the 32 KB memory map.
1 KB EEPROM + 4-Channel DMA — Best-in-Class Combo
The large EEPROM stores battery calibration data, cycle history, and device identity — while the DMA autonomously handles ADC data acquisition for continuous cell monitoring at µA-level average power.
Target Applications
OTA-Updatable Drone Battery BMS
Deployed drone battery modules with BLE or LoRa connectivity can receive firmware updates wirelessly via the dual-bank Flash architecture — no physical programmer access needed. Critical for fleet-managed commercial drone batteries.
Advanced Battery Health (SOH) Monitoring Node
The 32 KB Flash accommodates Coulomb-counting algorithms, impedance tracking, and capacity-fade prediction — enabling the BMS to accurately estimate remaining useful life (RUL) over hundreds of charge/discharge cycles.
Drop-In Flash Upgrade for G4-Based Designs
When an existing STM8L151G4-based design runs out of Flash, the G6 provides an immediate doubling with zero PCB changes — saving a board respin cycle.
Frequently Asked Questions
Can I switch from STM8L151G4 to G6 without changing the PCB?
Yes. The G4 and G6 share the identical UFQFPN-28 pinout and pad layout. Firmware must be recompiled for the G6's 32 KB memory map (linker script change), and any hard-coded Flash-size assumptions must be updated — but no PCB changes are required.
Does dual-bank Flash update work on the STM8L151?
The STM8L151's Flash controller supports in-application programming (IAP) — code can erase and write Flash while executing from Flash. However, true dual-bank (RWW — Read-While-Write) is NOT supported; the CPU stalls during Flash write operations. For safe OTA, the update protocol must tolerate the brief write-stall periods (~3 ms per word), or the bootloader must write the new firmware from SRAM. This is manageable with proper firmware architecture.
Ordering Information
| Orderable Part Number | Package | Packaging | Temperature |
|---|---|---|---|
| STM8L151G6U6 | UFQFPN-28 (4×4 mm, 0.5 mm pitch) | Tray | −40°C to +85°C |
| STM8L151G6U6TR | UFQFPN-28 | Tape & Reel | −40°C to +85°C |
| STM8L151G4U6 | UFQFPN-28 (4×4 mm) | Tray | −40°C to +85°C |
Design Resources
Datasheet (DS6882): STM8L151G4/G6 — Both G4 and G6 covered in one datasheet with UFQFPN-28 mechanical data.
Reference Manual (RM0031): STM8L05x/15x — Flash controller, IAP, and DMA documentation.
Application Note AN2659: STM8 IAP — In-Application Programming using STM8 USART — Example bootloader code adaptable for wireless OTA.
STM8CubeMX: Pinout configurator with memory map definition for G6 target.
Request a Quote
SUPERB Automation supplies genuine STMicroelectronics STM8L151G6U6 MCUs with full traceability and batch-level QA documentation. With 32 KB Flash and pin-compatibility with the G4, the STM8L151G6U6 enables dual-bank OTA updates and advanced BMS algorithms in the same 4×4 mm UFQFPN-28 footprint — the seamless memory upgrade for space-constrained drone sensor nodes. Whether you need prototype quantities for ESC firmware development or production volumes for drone BMS and PDB controller manufacturing, we source through verified channels with competitive lead times. Contact us with your target quantity, delivery date, and any special packaging or marking requirements — we'll respond with a detailed quotation within 24 hours.