AI Hardware Sourcing

8-12 Layer Edge AI Module and Carrier Board PCB

8 to 12-layer HDI for edge AI modules and carrier boards: 2+N+2 build-up, 0.35 mm BGA escape, LPDDR4X routing, thermal vias and warpage under 0.3%.

20-24 Layer AI Server Mainboard PCB

20 to 24-layer AI server mainboard fabrication: back-drilled vias, 2 to 3 oz power planes, hybrid low-loss stackup and impedance held to plus or minus 7%.

20-Layer 4-Stage HDI PCB for AI Accelerator Cards

20-layer 4-stage HDI fabrication for AI accelerator cards: low-loss hybrid stackup, 3/3 mil routing, back-drilled vias and impedance held to plus or minus 7%.