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Finished Board SpecificationsLayer Count (FR-4)1 – 20 layersHDI1–3阶 (mechanical blind or laser blind vias)Board Thickness0.6 – 3.2 mm (thickness varies with layer count)Thickness Tolerance (≥ 1.0 mm)±10%Thickness Tolerance (< 1.0 mm)±0.10 mmMax Board
Superb Automation operates PCB manufacturing facilities in Wuxi and Huizhou, supporting high-mix, high-complexity PCB production from prototype to volume. Combined monthly capacity exceeds 2.05 million sq.ft. (850K Wuxi + 1,200K Huizhou), expanding t
RoHS-compliant lead-free HASL standard. ENIG per IPC-4552 for fine-pitch. Immersion Ag, Sn, OSP also available.
Atotech ENIG line. Electroless Nickel Immersion Gold - flat solderable finish for fine-pitch BGA, wire bonding. XRF verified.
Atotech ENIG line. Electroless Nickel Immersion Gold - flat solderable finish for fine-pitch BGA, wire bonding & press-fit. Thickness verified by XRF on every panel.
8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber
.webp "10-Layer 2.60mm HD Multimedia Main Control PCB")
2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board
10-layer high-precision multilayer main control PCB: 1.60mm, 4/4 mil, ENIG, high-density BGA. Build-to-print from Gerber files. Full DFM, symmetrical lamination. RFQ
2.60 mm Thick · 4/5 mil Trace/Space · ENIG · 0.19 mm Micro-Via · Case Study: 10G Optical Fiber Transmission Board
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483.61 × 279.15 mm · 4/4 mil Trace/Space · ENIG · Full DFM Report · Case Study: dm6446-v3.0-0331-2
.webp "4-Layer Industrial Control PCB — 4× DDR Top/Bottom Mount, 167.64×111.15 mm, 4/4 mil, ENIG")
4-layer industrial control PCB: 4× DDR top/bottom, 167.64×111.15mm, 4/4 mil, ENIG. DFM verified, impedance controlled. Prototype to volume
RF & Wireless Communication PCBA turnkey assembly by Superb Automation. 6-layer hybrid PCB (Rogers RO4350B + FR4), ENIG finish, 400MHz–6GHz frequency range. Fully assembled with RF transceiver, PA, LNA, SAW/BAW filters, FPGA/SoC — SMT SAC305, selecti
6-layer ultra-thin HDI camera board by Superb Automation. 0.6mm finished thickness, 3/3mil trace/space, 4mil laser blind vias, ENIG finish, FR4 Tg≥150°C substrate. Optimized for MIPI D-PHY/C-PHY at 2.5Gbps/lane with
.webp "18-Layer TU883 2oz ENIG PCB for High-Current Power Distribution Backplane")
18-Layer 2nd-Order HDI · 2oz Thick Copper · TU883 · 2.6mm · ENIG; High-Current Power Distribution Backplane