RF & Wireless Communication PCBA
RF & Wireless Communication PCBA turnkey assembly by Superb Automation. 6-layer hybrid PCB (Rogers RO4350B + FR4), ENIG finish, 400MHz–6GHz frequency range. Fully assembled with RF transceiver, PA, LNA, SAW/BAW filters, FPGA/SoC — SMT SAC305, selective conformal coating, multi-cavity RF shielding.
Product Specifications
I. PCBA Technical Data Sheet – RF & Wireless Communication Module
| Product Type | Fully assembled PCBA (Printed Circuit Board Assembly) for RF transceiver / wireless communication sub‑system |
|---|---|
| Target Application | Wireless infrastructure: 5G small cell, IoT gateway, private LTE, satellite communication terminals, RF test equipment |
| PCBA Form Factor | 95mm x 75mm x 8.5mm (shielded modular design with edge mount connectors) |
| Base PCB Technology | 6‑layer Hybrid (Rogers RO4350B for RF front‑end + FR4 for baseband) with ENIG finish and controlled impedance |
| RF Frequency Bands | 400MHz – 6GHz (supports LTE, 5G NR sub‑6GHz, ISM bands, GNSS) |
| Key Components | RF transceiver (ADI/Lime Micro), Power Amplifier (PA), Low Noise Amplifier (LNA), RF switches, SAW/BAW filters, baseband FPGA/SoC, PMIC, clock generator |
| Assembly Technology | SMT with lead‑free solder (SAC305), selective conformal coating, automated optical inspection (AOI), X‑ray for BGA & QFN, flying probe test |
| RF Shielding | Multi‑cavity stamped metal shields with soldered fence; EMI absorbing material under shields for cavity resonance suppression |
| Impedance Control (PCB level) | 50Ω ±7% for RF traces (microstrip / coplanar waveguide); 100Ω ±10% for differential digital interfaces (JESD204B, LVDS) |
| Surface Finish (PCB) | ENIG (Ni 3‑5μm, Au 0.05‑0.1μm) for flat pad surfaces and good solderability of fine‑pitch components |
| Assembly Tolerances | Placement accuracy ±0.03mm for 0201 passives and 0.4mm pitch BGAs; coplanarity control for QFN components |
| Conformal Coating | Acrylic (AR) or silicone conformal coating for moisture and dust protection (IP54 rated optional) |
| Test & Verification | RF parametric test (power, EVM, sensitivity), boundary scan (JTAG), in‑system programming, thermal chamber test (-40°C to +85°C) |
| Reliability Standards | IPC-A-610 Class 3 (high reliability), thermal cycling, vibration, HALT (Highly Accelerated Life Test) |
| Production Volume Capacity | Up to 50,000 units/month with full traceability (individual serialization) |
[ IMAGE PLACEHOLDER 1 – SUGGESTED TYPE: Top and bottom view of fully assembled RF PCBA showing shielded RF section, digital baseband area, connectors, and conformal coating edge. ]
PCBA Process Flow & Key Assembly Capabilities
▼ SUPERB's RF‑optimized PCBA process flow
1. Solder paste printing (Type 4/5 SAC305) with 3D SPI control
2. High‑speed placement of 01005/0201 passives, BGAs, QFNs, connectors
3. Reflow soldering (nitrogen atmosphere, 8‑zone forced convection)
4. AOI (2D/3D) + X‑ray inspection for hidden solder joints (BGA, LGA)
5. Selective conformal coating (spray or brush) on sensitive RF areas
6. RF shield placement and reflow / hand soldering of shield fences
7. In‑circuit test (ICT) + RF functional test (calibration and performance verification)
8. Thermal cycling burn‑in (optional for high‑reliability applications)
◆ All processes are IATF 16949 and ISO 13485 certified.
| Key Process Parameter | Capability / Guarantee |
|---|---|
| Component pitch (min) | 0.4mm (BGAs, DFN); 0.35mm available for advanced projects |
| Placement accuracy | ±0.03mm (CPK ≥1.33) |
| Solder joint quality | AOI coverage 99.5%, X‑ray for BGAs and power devices |
| Conformal coating thickness | 25‑75μm, uniform coverage with UV inspection |
| RF shield soldering | No solder wicking into shield cavities, flatness ≤0.1mm |
| RF test frequencies | Up to 12GHz (vector network analyzer, spectrum analyzer, signal generator) |
[ IMAGE PLACEHOLDER 2 – SUGGESTED TYPE: Assembly line photo or diagram showing SMT placement, reflow oven, AOI, and RF test station with shielding box. ]
II. Application Case Stories – RF & Wireless Communication PCBA
Case 1 · 5G NR Small Cell RF Transceiver Module (n78 band)
A network equipment provider needed a compact, high‑performance PCBA for a 5G small cell operating in n78 band (3.5 GHz, 100 MHz bandwidth). The assembly included a 16‑transceiver RFIC, four PAs, LNAs, and a Zynq UltraScale+ FPGA. SUPERB developed a 6‑layer hybrid PCB (RO4350B + FR4) and assembled all components with 0.4mm pitch BGAs and 0201 passives. Conformal coating protected the RF front‑end from field humidity. The final PCBA achieved EVM <2% at 26 dBm output power, passed -40°C to +85°C thermal cycling, and met 3GPP specifications for small cell base stations. The customer reported 30% faster time‑to‑market due to SUPERB’s turnkey assembly and RF calibration service. Mass production reached 8,000 units/month with 99.2% first‑pass yield.
[ IMAGE PLACEHOLDER 3 – SUGGESTED TYPE: Assembled 5G small cell PCBA showing RF shields, heatsink attachment, and RF connectors; overlay with key component callouts. ]
Case 2 · Dual‑Channel Wideband Satellite Downconverter (L‑band to IF)
A satellite communication company required a high‑reliability PCBA for a L‑band (950‑2150 MHz) downconverter used in VSAT terminals. The assembly comprised a dual mixer, LO synthesizer, IF amplifiers, and an FPGA for gain control. The challenge was maintaining phase noise below -100 dBc/Hz @10kHz and gain flatness ±0.5 dB over the full band. SUPERB assembled the board using controlled‑impedance RF lines, with tight placement of the mixer and LO components to minimize parasitic coupling. After assembly, each unit underwent full 2‑port VNA calibration and thermal chamber testing. The PCBA achieved −105 dBc/Hz phase noise and passed 500 hours of 85°C operation (burn‑in). The design is now deployed in over 10,000 maritime VSAT terminals.
Case 3 · Private LTE Gateway (Band 14 / Band 48)
An industrial IoT company developed a private LTE gateway for first responder networks (Band 14, 758‑768 MHz) and CBRS (Band 48, 3.55‑3.7 GHz). The PCBA combined two independent RF chains (PA, LNA, transceiver) with a multi‑core application processor. SUPERB provided turnkey assembly including selective conformal coating for outdoor use, and soldered cage‑style shields for each RF section. X‑ray inspection verified BGA solder joints under the transceiver and processor. The gateway passed FCC/ISED radiated emissions and achieved IP54 rating after coating. Volume production ramped to 15,000 units/month with 98.5% functional test pass rate. The customer praised SUPERB’s ability to handle mixed RF/digital assemblies with strict ESD controls.
Software Defined Radio (SDR) Board
Wideband SDR (70 MHz to 6 GHz) PCBA with LimeSDR chipset. SUPERB assembled 0.4mm pitch QFN and multiple RF switches, achieving EVM <1.5% for 64‑QAM at 5.8 GHz. Full production test with GNU Radio calibration.
GNSS Timing Receiver (L1/L2/L5)
High‑precision timing PCBA for critical infrastructure (power grid, telecom). SUPERB assembled low‑noise RF front‑end with SAW filters and a multi‑constellation GNSS engine. Achieved sub‑5 ns timing accuracy.
RF Test & Measurement Fixture
Custom RF switch matrix PCBA for automated test equipment (ATE). SUPERB provided full assembly with high‑frequency relays, PCB edge launchers, and calibration path. Achieved repeatable insertion loss <0.2dB up to 12GHz.
III. Technical Advantages for RF & Wireless PCBA
| RF‑Optimized Assembly Process | Controlled solder paste volume, minimized voiding under thermal pads (RF power devices), and low‑loss solder materials (SAC305). |
|---|---|
| Shielding & EMI Management | Multi‑cavity shields with absorbing material; soldered fences prevent signal leakage; optimized ground via stitching on PCB. |
| High‑Reliability Interconnects | X‑ray inspection for all BGAs/QFNs; IPC‑A‑610 Class 3 workmanship standards; 100% AOI on fine‑pitch components. |
| Comprehensive RF Test | Custom test fixtures for gain, NF, P1dB, EVM, spurious; temperature‑chamber characterization; serialized test reports. |
| Conformal Coating for Field Durability | Selective acrylic/silicone coating protects RF circuits from moisture, salt spray, and dust without degrading high‑frequency performance. |
Quality Certifications & Compliance
IPC-A-610 Class 3 (Electronic Assembly Acceptance)
ISO 9001:2015 & IATF 16949 (Automotive grade assembly line)
J-STD-001 (Solder process compliance)
RoHS 2.0 / REACH / WEEE compliant
ISO 13485 (Medical device assembly – optional)
100% RF functional test + serialized traceability
IV. Complete PCBA Turnkey Solution
SUPERB provides a full turnkey PCBA service for RF and wireless communication products. From PCB fabrication (hybrid, controlled impedance) to component sourcing (authorized distributors), SMT assembly, conformal coating, RF shielding, and final test – all under one roof. Our engineering team reviews Gerber, BOM, and centroid files, recommends DFM/DFT improvements, and develops custom RF test plans. Prototype lead time: 7‑10 days for full assembly (10‑20 units). Mass production capacity: up to 50,000 units/month with automated SMT lines (12 high‑speed placement machines, 5 reflow ovens, 3 AOI, 2 X‑ray). We support worldwide shipping with ESD‑safe packaging and full documentation.
Design & Assembly Summary
Min component: 01005 (0.4x0.2mm)
BGA pitch: 0.35mm (micro‑BGA)
RF frequency: DC to 12GHz
Conformal coating: acrylic / silicone
Shield types: one‑piece / two‑piece
Production Capacity (SUPERB)
SMT lines: 12 (high‑speed)
Placement speed: 120k CPH
Monthly output: 50k units
Lead time for MP: 2‑3 weeks
Test & Validation Equipment
VNA up to 20GHz / Spectrum Analyzer
Signal generators / Power meters
Thermal chamber (-55°C to +150°C)
Boundary scan / JTAG / ICT fixtures