Finished Board Specifications
| Layer Count (FR-4) | 1 – 20 layers |
| HDI | 1–3阶 (mechanical blind or laser blind vias) |
| Board Thickness | 0.6 – 3.2 mm (thickness varies with layer count) |
| Thickness Tolerance (≥ 1.0 mm) | ±10% |
| Thickness Tolerance (< 1.0 mm) | ±0.10 mm |
| Max Board Size — 1/2/4 Layer | 520 × 600 mm |
| Max Board Size — ≥ 6 Layer | 400 × 500 mm |
| Min Board Size — Non-OSP | ≥ 50 × 50 mm (≥ 5 mm²); minimum 10 × 10 mm for < 5 mm² |
| Min Board Size — OSP | ≥ 80 × 50 mm |
| Process Edge | ≥ 3 mm |
| Metal Edge Wrapping | Supported |
| Half-Hole (Castellated) | Supported |
| Via-in-Pad (POFV) | Supported |
| Blind Via Copper Fill Plating | Supported |
Base Materials (FR-4)
| Material Type | FR-4 |
| Brands | Shengyi (生益), Jiantao (建滔), Jin'an Guojig (金安国纪), and others |
| Grade | A-grade |
| Tg Values | 130°C / 150°C / 170°C |
| CTI | ≥ 175V |
| Breakdown Voltage | ≥ 4,000V |
| Flame Rating | UL-94 V0 |
Drilling
| Mechanical Drill Range | 0.15 mm ≤ ∅ ≤ 6.35 mm (expandable for ∅ > 6.35 mm) |
| Laser Drill Range | 0.075 mm ≤ ∅ ≤ 0.15 mm (> 0.15 mm possible; mechanical preferred for cost) |
| Plated Slot Hole | ≥ 0.50 mm |
| Non-Plated Slot Hole | ≥ 0.80 mm |
| Half-Hole Diameter | ≥ 0.50 mm |
| Half-Hole Spacing | ≥ 0.90 mm |
| Aspect Ratio | 10:1 (board thickness ÷ drill diameter) |
| Hole Position Tolerance | ±0.075 mm |
| PTH Diameter Tolerance — Standard | ±0.075 mm |
| PTH Diameter Tolerance — Press-Fit | ±0.05 mm |
| NPTH Diameter Tolerance | ±0.05 mm |
| Slot Hole Tolerance | ±0.10 mm |
Plating & Copper
| Base Copper — Inner Layer | 0.5 – 4 oz |
| Base Copper — Outer Layer | 1 oz (standard) |
| Plated Copper Thickness | ≥ 20 µm (calculated at 0.5 oz / 18 µm for standard impedance) |
| Hole Wall Copper — Through-Hole | Average ≥ 20 µm (IPC Class 2; Class 3 requires process review) |
| Hole Wall Copper — Mechanical Blind Via | Average ≥ 20 µm |
| Via Fill Dimple (Blind Via) | ≤ 10 µm (for vias requiring flat fill) |
Imaging & Trace/Space
| Trace Width Tolerance | ±20% |
| Min Inner Line/Space — 0.5 oz (18 µm) | ≥ 2.5 / 3.0 mil |
| Min Inner Line/Space — 1 oz (35 µm) | ≥ 3.0 / 3.0 mil |
| Min Inner Line/Space — 2 oz (70 µm) | ≥ 5.5 / 5.5 mil |
| Min Outer Line/Space — 1 oz (35 µm) | ≥ 3.0 / 3.0 mil |
| Min Outer Line/Space — 2 oz (70 µm) | ≥ 5.5 / 5.5 mil |
| Min Grid Line/Space — 1 oz | ≥ 6.0 / 6.0 mil |
| Min Grid Line/Space — 2 oz | ≥ 10.0 / 10.0 mil |
| Min Annular Ring — Via (1 oz) | ≥ 3.5 mil |
| Min Annular Ring — Component Hole (1 oz) | ≥ 8.0 mil |
| Min Annular Ring — Via (2 oz) | ≥ 4.5 mil |
| Min Annular Ring — Component Hole (2 oz) | ≥ 10.0 mil |
| Min BGA Pad — HASL | ≥ 10 mil (shortest side for rectangular) |
| Min BGA Pad — ENIG | ≥ 8 mil (shortest side for rectangular) |
| Min BGA Pad Pitch | ≥ 0.45 mm |
Controlled Impedance
| > 50Ω Tolerance | ±10% |
| ≤ 50Ω Tolerance | ±5Ω |
| Single-Ended Impedance Range | ≤ 75Ω |
| Differential Impedance Range | ≤ 150Ω |
| Dielectric Constant — Core (Reference) | Dk 4.2 |
| Dielectric Constant — Solder Mask (Reference) | Dk 3.5 |
Solder Mask
| Colors | Green, Blue, Red, Yellow, White, Black, Matte Black (others by process review) |
| Ink Thickness on Trace | 15 ± 10 µm |
| Solder Mask Opening | ≥ 1.5 mil |
| Solder Mask Dam — Green | ≥ 3.5 mil |
| Solder Mask Dam — White/Black | ≥ 5 mil |
| Solder Mask Dam — Other Colors | ≥ 4 mil |
| Via Treatment Options | Covered, Windowed, Plugged (aluminum sheet / ink plug), Resin-filled |
| Plug Via Diameter Range | 0.20 mm < ∅ ≤ 0.45 mm (outside range risks poor plugging) |
Silkscreen & Legend
| Colors | White, Black (yellow etc. by process review) |
| Etched Legend — Line/Height | ≥ 4 mil / 25 mil |
| Screen-Printed — 1 oz | ≥ 5 mil / 30 mil |
| Screen-Printed — 2 oz | ≥ 7 mil / 42 mil |
| Screen-Printed — 3 oz | ≥ 12 mil / 50 mil |
| Inkjet Legend — Width/Height | 0.075 mm / 0.60 mm |
Surface Finish
| Available Finishes | HASL (lead / lead-free), ENIG, OSP, Electroplated Nickel-Gold |
| ENIG — Nickel Thickness | 100 – 200 µ-inch (2.54 – 5.08 µm) |
| ENIG — Gold Thickness | 2 – 3 µ-inch (0.05 – 0.08 µm) |
| Electroplated Ni/Au — Nickel | 120 – 200 µ-inch |
| Electroplated Ni/Au — Gold | 8 – 12 µ-inch |
| ENIG Min Spacing — Pad-to-Pad / Finger-to-Finger | ≥ 5 mil (prevents gold bleeding) |
Routing & Profile
| Outline Tolerance | ±0.15 mm (industry standard ±0.20 mm) |
| Trace-to-Board-Edge (CNC Rout) | ≥ 0.20 mm |
| V-Cut Angle Options | 30°, 45°, 60° |
| V-Cut Max Blade Count | ≤ 30 blades |
| V-Cut Board Width Range | 60 mm ≤ width ≤ 480 mm |
| V-Cut Residual Thickness | 0.25 – 0.50 mm |
| V-Cut Residual Tolerance | ±0.10 mm |
| Gold-Finger Bevel — Board Thickness | 0.8 – 2.0 mm |
| Gold-Finger Bevel — Length | 30 – 280 mm |
| Gold-Finger Bevel — Height | ≥ 40 mm |
| Gold-Finger Bevel — Angles | 20°, 30°, 45°, 60° |
| Gold-Finger Bevel — Angle Tolerance | ±5° |
| Gold-Finger Bevel — Depth Tolerance | ±0.15 mm |
Electrical Testing
| Flying Probe Test Points | Unlimited |
| Test Fixture Max Points | < 14,000 points |
| Min IC / BGA Pad for Probing | ≥ 8 mil |
| Warpage (SMT) | ≤ 0.75% (≤ 1.5% for through-hole only) |
Delivery & Documentation
| Shipping Format — Single Piece | Supported |
| Shipping Format — Panel (per set) | Supported |
| Panelization — Zero-Gap | Supported (suitable for rectangular outlines) |
| Panelization — Gapped | Gap > 1.6 mm, supported (suitable for straight-edge non-rectangular) |
| Panelization — Stamp-Hole (Mouse-Bite) | Supported (suitable for curved/irregular outlines) |
| Standard Delivery Report | Supported |
| Microsection Report | Supported |
| Impedance Test Report | Supported |
Send your Gerber files to pcba@superb-tech.com for a free DFM review against these specifications.
