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PCB Design & Manufacturing Capabilities

PCB Design & Manufacturing Capabilities

PCB Manufacturing Capabilities

Up to 128 Layers (Wuxi) · 0.0125mm Fine-Line · 0.05mm Laser Drill · ENIG / ENEPIG · HDI · Rigid-Flex · Heavy Copper · Two Facilities

Overview

Superb Automation operates PCB manufacturing facilities in Wuxi and Huizhou, supporting high-mix, high-complexity PCB production from prototype to volume. Combined monthly capacity exceeds 2.05 million sq.ft. (850K Wuxi + 1,200K Huizhou), expanding to 2.4M sq.ft. Core strengths are high-speed digital PCBs and RF/microwave PCBs — from material selection through back-drill and impedance testing — alongside HDI, rigid-flex, heavy copper, and metal-core boards. Wuxi operates at the leading edge with 0.0125mm fine-line capability and up to 128 layers.


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High-Speed & RF PCB — Core Manufacturing Strength

High-speed digital and RF/microwave PCBs are our primary focus. We stock and process the full range of advanced laminates and offer in-house back-drilling, precision impedance control, and TDR verification for designs operating from sub-1 GHz through 77 GHz and beyond.

High-Speed Digital PCB Materials & Processes

Ultra-Low-Loss MaterialsPanasonic Megtron 6, Megtron 7; Isola Tachyon 100G, I-Tera MT40; Nelco N4000-13 EP
Max Data Rate112G PAM4 (back-drilled vias, full-link SI simulation)
Typical Layer Count20–68 layers for switch fabrics, AI accelerators, 400G/800G networking
Back-DrillIn-house, depth control ±0.05 mm — stub removal for 25G+ serial links (PCIe Gen4/5, 100G Ethernet)
Differential Impedance85Ω / 100Ω, tolerance ±5% (critical ±3% available)
ApplicationsData center switches, AI/GPU accelerator cards, 5G backhaul, optical transceivers

RF & Microwave PCB Materials & Processes

Rogers MaterialsRO4003C, RO4350B (Dk 3.48), RO3003 (Dk 3.00), RT/duroid 5880 (Dk 2.20)
Taconic MaterialsRF-35 (Dk 3.50), TLY-5 (Dk 2.20), CER-10 (Dk 10.0 for filters/couplers)
PTFE-Based LaminatesPlasma-treated for reliable plated through-holes in PTFE substrates
Frequency RangeSub-1 GHz through 77 GHz (automotive radar, millimeter-wave)
Hybrid ConstructionRF laminate + FR-4 digital layers in a single stackup
Impedance Control50Ω single-ended, ±5% standard, TDR coupon on every panel
Applications5G AAU/RRU, phased-array radar, satellite communications, automotive 77 GHz radar

Manufacturing Capabilities — Wuxi vs Huizhou

General Parameters

ParameterWuxi (Current)Huizhou (Current)Wuxi (Future)Huizhou (Future)
Monthly Capacity850 kSF1,200 kSF900 kSF1,500 kSF
Max Layers1286813868
Min Line Width / Spacing0.0125 / 0.0125 mm0.05 / 0.05 mm0.0125 / 0.0125 mm0.04 / 0.04 mm
Min Mechanical Drill0.10 mm0.10 mm0.075 mm0.075 mm
Min Laser Drill0.05 mm0.05 mm0.05 mm0.05 mm
Electrical Test Pitch0.20 mm0.20 mm0.20 mm0.20 mm
2-Layer Board Min Thickness0.15 mm0.15 mm0.10 mm0.10 mm
4-Layer Board Min Thickness0.25 mm0.25 mm0.20 mm0.20 mm

Surface Finishes

FinishWuxiHuizhou
OSP / ENIG / Selective ENIG
ENEPIG / Hard Gold / Soft Gold
Immersion Tin / Immersion Silver
HASL (Lead-Free)OutsourcedOutsourced

Materials & Special Processes

CapabilityWuxiHuizhou
FR-4 High-Tg / Halogen-Free
BT Resin / High-Speed Materials
Polyimide / EMI Shielding
HDI / Rigid-Flex
Heavy Copper / Back-DrillLimited
Copper Inlay / High-ThermalLimited

PCB Design Services

Engineering support for high-speed digital, RF/microwave, and analog PCB design — from schematic to production-ready Gerber files. DFM alignment is integrated throughout the design phase to ensure manufacturability at the fabrication stage.

Design Coverage

High-Speed DigitalMulti-layer digital PCBs, DDR2/3/4 memory layout, PCIe, Ethernet high-speed serial links
RF / MicrowaveRF circuit boards, printed antenna (BLE/Wi-Fi), impedance-controlled routing
Analog & Mixed-SignalLow-level analog design, ultra-low EMI for medical imaging, pulse circuits, SI/PI analysis
HDI & Dense LayoutAuto-routing for high-density interconnect, fine-pitch BGA fanout, via-in-pad
Embedded ProcessorsPowerPC, Intel x86, TI DSP, ARM, RISC-V platforms
Mechanical & DFMPackaging design, thermal simulation (CFD), FEA vibration analysis, DFM/DFA cost reduction

Industry Experience

Telecom & 5GRemote communication, RF transmission, base station infrastructure
IndustrialProcess control, automation, high-reliability computing
MedicalDiagnostic equipment, patient monitoring, MRI-compatible low-EMI design
Aerospace & DefenseAviation control, flight data systems, high-reliability electronics
ScientificMulti-processor systems, data acquisition, instrumentation

Embedded Development

Engineering support for embedded hardware and firmware development across the full product lifecycle — system architecture, schematic design, PCB layout, firmware, and production test. Platforms include ARM, RISC-V, x86, NXP, STM32, TI, Infineon, Microchip, and Renesas. RTOS and embedded Linux (FreeRTOS, Zephyr, Yocto, Buildroot) supported.

Key Competencies

Embedded PlatformsARM Cortex-M/A, RISC-V, x86, NXP (Freescale), Infineon, Texas Instruments, Microchip, Renesas, STM32
SoftwareC/C++, Rust, Assembly; bare-metal, FreeRTOS, Zephyr, VxWorks, embedded Linux (Yocto/Buildroot)
Control & AlgorithmsMotor control (FOC, trapezoidal), sensor fusion, real-time closed-loop, MATLAB/Simulink model-based design
CommunicationCANopen, Modbus, EtherCAT, MQTT, Zigbee, BLE; secure boot, TLS, encrypted firmware update
Low-Power DesignBattery-operated devices, sleep/wake state optimization, energy budgeting

Application Domains

IndustrialAutomation, robotics, PLC, CNC, servo drives
MedicalPatient monitors, infusion pumps, imaging, diagnostic equipment
AutomotiveECU, body control, telematics, EV subsystems
Aerospace & DefenseAvionics, flight data recorders, navigation systems
IoT & EdgeGateways, edge computing, smart energy, agricultural automation
ConsumerSmart home, wearables, connected appliances

DFM & Quality Assurance

Every PCB order undergoes a free DFM manufacturability review before production release. The review covers file integrity, stackup verification, impedance control requirements, special process validation, and assembly compatibility.

DFM Checklist

File VerificationCorrect Gerber/ODB++ format, netlist match, latest revision timestamp
Process SelectionLead-free / leaded (RoHS compliance), surface finish specification
Stackup & PanelizationReasonable layer stackup, panelization style, material selection
Component ReadinessClear silkscreen reference designators, BOM alignment, polarity markings
Special ProcessesControlled impedance, back-drill, ENIG/ENEPIG, mixed materials
TestabilityFlying probe / ICT access, functional test plan, thermal-sensitive component handling
DocumentationAssembly drawings, schematic reference, production manuals, programming records
DFM Policy: All DFM findings are documented with coordinates and severity grades. Process-level corrections are applied in CAM without design changes. Items requiring design modification are escalated for customer approval before production.

Request a Capability Review — Send Your Gerber Files or Design Requirements to pcba@superb-tech.com

Tags

PCB Manufacturing
HDI PCB
High-Speed PCB
RF & Microwave PCB
Rigid-Flex PCB
Heavy Copper PCB
Multilayer PCB
ENIG
Fine-Line
Back-Drill
Embedded Development
DFM
Wuxi
Huizhou
Superb Automation



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