PCB Design & Manufacturing Capabilities

2026-10-05

PCB Manufacturing Capabilities

Up to 68 Layers · 0.0125mm Fine-Line · 0.05mm Laser Drill · ENIG / ENEPIG · HDI · Rigid-Flex · Heavy Copper

Overview

Superb Automation supports high-mix, high-complexity PCB production from prototype to volume, with engineering, fabrication and test under one roof. Core strengths are high-speed digital PCBs and RF/microwave PCBs - from material selection through back-drill and impedance testing - alongside HDI, rigid-flex, heavy copper and metal-core boards.

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High-Speed & RF PCB — Core Manufacturing Strength

High-speed digital and RF/microwave PCBs are our primary focus. We stock and process the full range of advanced laminates and offer in-house back-drilling, precision impedance control, and TDR verification for designs operating from sub-1 GHz through 77 GHz and beyond.

High-Speed Digital PCB Materials & Processes

Ultra-Low-Loss Materials	Panasonic Megtron 6, Megtron 7; Isola Tachyon 100G, I-Tera MT40; Nelco N4000-13 EP
Max Data Rate	112G PAM4 (back-drilled vias, full-link SI simulation)
Typical Layer Count	20–68 layers for switch fabrics, AI accelerators, 400G/800G networking
Back-Drill	In-house, depth control ±0.05 mm — stub removal for 25G+ serial links (PCIe Gen4/5, 100G Ethernet)
Differential Impedance	85Ω / 100Ω, tolerance ±5% (critical ±2% available)
Applications	Data center switches, AI/GPU accelerator cards, 5G backhaul, optical transceivers

RF & Microwave PCB Materials & Processes

Rogers Materials	RO4003C, RO4350B (Dk 3.48), RO3003 (Dk 3.00), RT/duroid 5880 (Dk 2.20)
Taconic Materials	RF-35 (Dk 3.50), TLY-5 (Dk 2.20), CER-10 (Dk 10.0 for filters/couplers)
PTFE-Based Laminates	Plasma-treated for reliable plated through-holes in PTFE substrates
Frequency Range	Sub-1 GHz through 77 GHz (automotive radar, millimeter-wave)
Hybrid Construction	RF laminate + FR-4 digital layers in a single stackup
Impedance Control	50Ω single-ended, ±5% standard, TDR coupon on every panel
Applications	5G AAU/RRU, phased-array radar, satellite communications, automotive 77 GHz radar

Manufacturing Capabilities

General Parameters

Parameter	Capability
Monthly Capacity	2.05M sq.ft
Max Layers	68
Min Line Width / Spacing	0.0125 / 0.0125 mm
Min Mechanical Drill	0.075 mm
Min Laser Drill	0.05 mm
Min Blind Via / Microvia	0.05 mm
Electrical Test Pitch	0.20 mm
Board Thickness	0.1 - 12 mm
Max Panel Size	622 x 1092 mm
Max Copper Thickness	Inner 6 OZ / Outer 10 OZ
PTH Aspect Ratio	25:1
Back-Drill Stub	≤ 0.25 mm (target ≤ 0.1 mm)
Layer-to-Layer Registration	±0.025 - 0.06 mm
Impedance Tolerance	±5% standard; ±2% for critical designs
High-Speed Routing	25 Gbps differential pairs

Advanced PCB Capabilities

Capability	Specification
HDI (ELIC)	Up to 30 layers, every-layer interconnect
Rigid-Flex	Up to 32 layers (5+N+5 any-layer)
Rigid-Flex Min Line Width	0.03 mm (inner / outer)
Rigid-Flex Min Core Thickness	12.5 μm (excluding copper)
HDI Fan-Out Line Width	0.035 mm
IC Substrate Min Pad / Spacing	50 μm / 40 μm
Min Solder Mask Dam	50 μm
Via Fill Dimensional Recess	≤ 5 μm
Warpage	≤ 0.5%
BGA Pitch	0.3 mm

Design Team & Engineering Resources

Item	Detail
Design Team	100+ designers, average 10 years experience
Track Record	1,000+ customers across 20+ countries
Design Types	High-speed, schematic, mixed-signal, high-density, high-voltage, high-power, RF, ATE, backplane
EDA Tools	Allegro, PADS, Altium, Mentor, OrCAD, Concept-HDL, DxDesigner, Protel DXP

Surface Finishes

Finish	Availability
OSP / ENIG / Selective ENIG	Yes
ENEPIG / Hard Gold / Soft Gold	Yes
Immersion Tin / Immersion Silver	Yes
HASL (Lead-Free)	Outsourced

Materials & Special Processes

Capability	Availability
FR-4 High-Tg / Halogen-Free	Yes
BT Resin / High-Speed Materials	Yes
Polyimide / EMI Shielding	Yes
HDI / Rigid-Flex	Yes
Heavy Copper / Back-Drill	Yes
Copper Inlay / High-Thermal	Yes

PCB Design Services

Engineering support for high-speed digital, RF/microwave, and analog PCB design — from schematic to production-ready Gerber files. DFM alignment is integrated throughout the design phase to ensure manufacturability at the fabrication stage.

Design Coverage

High-Speed Digital	Multi-layer digital PCBs, DDR2/3/4 memory layout, PCIe, Ethernet high-speed serial links
RF / Microwave	RF circuit boards, printed antenna (BLE/Wi-Fi), impedance-controlled routing
Analog & Mixed-Signal	Low-level analog design, ultra-low EMI for medical imaging, pulse circuits, SI/PI analysis
HDI & Dense Layout	Auto-routing for high-density interconnect, fine-pitch BGA fanout, via-in-pad
Embedded Processors	PowerPC, Intel x86, TI DSP, ARM, RISC-V platforms
Mechanical & DFM	Packaging design, thermal simulation (CFD), FEA vibration analysis, DFM/DFA cost reduction

Industry Experience

Telecom & 5G	Remote communication, RF transmission, base station infrastructure
Industrial	Process control, automation, high-reliability computing
Medical	Diagnostic equipment, patient monitoring, MRI-compatible low-EMI design
Aerospace & Defense	Aviation control, flight data systems, high-reliability electronics
Scientific	Multi-processor systems, data acquisition, instrumentation

Embedded Development

Engineering support for embedded hardware and firmware development across the full product lifecycle — system architecture, schematic design, PCB layout, firmware, and production test. Platforms include ARM, RISC-V, x86, NXP, STM32, TI, Infineon, Microchip, and Renesas. RTOS and embedded Linux (FreeRTOS, Zephyr, Yocto, Buildroot) supported.

Key Competencies

Embedded Platforms	ARM Cortex-M/A, RISC-V, x86, NXP (Freescale), Infineon, Texas Instruments, Microchip, Renesas, STM32
Software	C/C++, Rust, Assembly; bare-metal, FreeRTOS, Zephyr, VxWorks, embedded Linux (Yocto/Buildroot)
Control & Algorithms	Motor control (FOC, trapezoidal), sensor fusion, real-time closed-loop, MATLAB/Simulink model-based design
Communication	CANopen, Modbus, EtherCAT, MQTT, Zigbee, BLE; secure boot, TLS, encrypted firmware update
Low-Power Design	Battery-operated devices, sleep/wake state optimization, energy budgeting

Application Domains

Industrial	Automation, robotics, PLC, CNC, servo drives
Medical	Patient monitors, infusion pumps, imaging, diagnostic equipment
Automotive	ECU, body control, telematics, EV subsystems
Aerospace & Defense	Avionics, flight data recorders, navigation systems
IoT & Edge	Gateways, edge computing, smart energy, agricultural automation
Consumer	Smart home, wearables, connected appliances

DFM & Quality Assurance

Every PCB order undergoes a free DFM manufacturability review before production release. The review covers file integrity, stackup verification, impedance control requirements, special process validation, and assembly compatibility.

DFM Checklist

File Verification	Correct Gerber/ODB++ format, netlist match, latest revision timestamp
Process Selection	Lead-free / leaded (RoHS compliance), surface finish specification
Stackup & Panelization	Reasonable layer stackup, panelization style, material selection
Component Readiness	Clear silkscreen reference designators, BOM alignment, polarity markings
Special Processes	Controlled impedance, back-drill, ENIG/ENEPIG, mixed materials
Testability	Flying probe / ICT access, functional test plan, thermal-sensitive component handling
Documentation	Assembly drawings, schematic reference, production manuals, programming records

DFM Policy: All DFM findings are documented with coordinates and severity grades. Process-level corrections are applied in CAM without design changes. Items requiring design modification are escalated for customer approval before production.

Request a Capability Review — Send Your Gerber Files or Design Requirements to pcba@superb-tech.com