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TPS82085SILR

TPS82085SILR

Texas Instruments - 3A Continuous, DCS-Control, 17uA IQ, 2.4MHz, 8-uSiP 2.8x3.0mm, -40 to +125C MFR Part #: TPS82085SILRSuperb SKU: SUP-TPS82085SILR In Stock - Ready to Ship The TPS82085SILR is a 3A step-down DC-DC converter MicroSiP module from Texas Instruments, integrating the buck converter IC and power inductor into a single 2.8x3.0mm package. Optimized for 2.5V to 6V input (single Li-Ion, USB 5V, 3.3V rails), it delivers up to 3A with 95% peak efficiency at 2.4MHz switching frequency. The DCS-Control topology provides fast transient response with seamless PWM-to-Power-Save transition, and the 17uA quiescent current extends battery life in always-on applications. With -40C to +125C operation and an ultra-compact footprint requiring only 4-5 external passives, it is the ideal power solution for IoT wearables, portable medical devices, and space-constrained battery-powered embedded systems.

GRM188C80E107ME01D

GRM188C80E107ME01D

Murata Manufacturing - Monolithic Ceramic Capacitor, 1.6x0.8x0.8mm, +/-20% Tolerance, Low ESR/ESL MFR Part #: GRM188C80E107ME01DSuperb SKU: SUP-GRM188C80E107ME01D In Stock - Ready to Ship The GRM188C80E107ME01D is Murata's industry-first 100uF MLCC in 0603 size, achieving breakthrough capacitance density through advanced fine-particle X6S dielectric and sub-micron layer lamination technology. Rated at 2.5V with ultra-low ESR and ESL inherent to monolithic ceramic construction, it enables single-component bulk decoupling on low-voltage FPGA/ASIC core rails (1.0V, 1.2V, 1.8V) where board space is at a premium. The 1.6x0.8mm footprint eliminates the need for multiple smaller capacitors or larger tantalum electrolytics — a single GRM188C80E107ME01D replaces 10x 10uF 0603 MLCCs or 2-3 tantalum capacitors, dramatically reducing BOM count and PCB area in power-dense embedded designs.

W25N01GVZEIG

W25N01GVZEIG

Winbond Electronics - 128MB, 2KB+64B Page, On-Die ECC, 100K P/E, 10-Year Retention, Industrial -40 to +85C MFR Part #: W25N01GVZEIGSuperb SKU: SUP-W25N01GVZEIG In Stock - Ready to Ship The W25N01GVZEIG is a 1Gb (128MB) SLC SPI NAND Flash from Winbond, delivering 8x the density of a 128Mb NOR at approximately 1/3 the cost per bit. Operating at 104MHz Quad SPI (up to 416 Mbps), it combines SPI's low pin count with NAND's cost-efficient high-density storage. The 2KB+64B page architecture with on-die 1-bit ECC simplifies host-side error correction, while continuous read and buffer read modes optimize throughput for sequential data access. With 100,000 P/E cycles, 10-year retention, and industrial -40 to +85C rating, it serves as cost-effective boot media for embedded Linux, firmware storage for IoT gateways, and high-density data logging where NOR Flash capacity is insufficient and eMMC is overkill.

OP2177ARMZ

OP2177ARMZ

The OP2177ARMZ is Analog Devices' benchmark precision dual operational amplifier, delivering 15uV typical offset voltage with an ultra-low 0.2uV/C drift — performance that eliminates external trimming in virtually all DC-precision applications. Each channel combines 1.3MHz gain-bandwidth, 8nV/rtHz voltage noise, 500pA input bias current, and only 0.5mA supply current across a wide 5V to 30V supply range. The dual-channel MSOP-8 package (3x3mm) provides two precision amplifiers in the footprint of a single SOIC-8. Outputs are stable with capacitive loads exceeding 1000pF with no external compensation. From bridge/load-cell signal conditioning to thermocouple amplifiers and medical instrumentation, the OP2177 is the gold standard for precision dual op-amp designs.

LM5164DDAR

LM5164DDAR

The LM5164DDAR is a wide-input-voltage, 1A synchronous buck DC-DC converter from Texas Instruments — designed to step down voltages from as high as 100V to a regulated output as low as 1.2V, all from a single 8-pin SO PowerPAD package. With integrated high-side and low-side N-channel MOSFETs, constant on-time (COT) control for fast transient response, and an industry-leading sub-10µA no-load quiescent current, it is the go-to regulator for always-on industrial sensors, 48V telecom power supplies, Power-over-Ethernet (PoE) powered devices, and automotive battery-connected electronics where every microamp of standby current counts.

MT41K128M16JT-125:K

MT41K128M16JT-125:K

The MT41K128M16JT-125:K is a 2 Gb (256 MB) DDR3L SDRAM component from Micron Technology, organized as 128M × 16-bit and rated for DDR3L-1600 (1600 MT/s, PC3-12800). At 1.35V with full backward compatibility to 1.5V DDR3, it delivers twice the density of the 1Gb MT41K64M16 in the same 96-ball FBGA package — 3.2 GB/s peak bandwidth from a single chip for FPGA configuration, embedded Linux, and industrial controllers where 128 MB is too tight and migrating to DDR4 carries unnecessary overhead.

MT41K64M16TW-107:J

MT41K64M16TW-107:J

The MT41K64M16TW-107:J is a 1 Gb (128 MB) DDR3L SDRAM component from Micron Technology, organized as 64M × 16-bit and rated for DDR3L-1866 (1866 MT/s, PC3-14900). Operating at just 1.35V with full backward compatibility to standard 1.5V DDR3, it delivers up to 3.7 GB/s of peak bandwidth in a single x16 chip — making it the workhorse memory for FPGA configuration buffers, networking line cards, industrial single-board computers, and legacy platform maintenance where DDR3L remains the pragmatic choice.

BMI270

BMI270

The BMI270 is an ultra-low-power 6-axis MEMS inertial measurement unit (IMU) from Bosch Sensortec, combining a 16-bit triaxial accelerometer and a 16-bit triaxial gyroscope in a single 2.5 × 3.0 × 0.8 mm LGA-14 package. Drawing just 685 µA in full 6-axis operation, it is purpose-built for always-on motion sensing in wrist-worn wearables, true wireless earbuds (hearables), AR/VR headsets, and motion-enabled IoT devices. On-chip smart interrupt engines for gesture, context, and activity recognition offload the host processor — extending battery life in space-constrained, energy-sensitive designs.

MT40A512M16TB-062E:R

MT40A512M16TB-062E:R

The MT40A512M16TB-062E:R is an 8 Gb (1 GB) DDR4 SDRAM component from Micron Technology, organized as 512M × 16-bit and rated for DDR4-3200 (3200 MT/s, PC4-25600). Packaged in a compact 96-ball TFBGA, it delivers 12.8 GB/s of peak bandwidth in a dual-chip 32-bit embedded configuration — making it the go-to DRAM choice for ARM-based embedded SoCs (NXP i.MX8, Rockchip RK3568, Xilinx Zynq), networking equipment, and industrial computing platforms. The :R suffix designates tape-and-reel packaging for automated high-volume assembly.

AD9361BBCZ

AD9361BBCZ

The AD9361BBCZ is a high-performance, highly integrated 2×2 RF Agile Transceiver™ from Analog Devices — the industry-standard RF front-end for software-defined radio (SDR), 4G base stations, drone datalinks, and wideband test & measurement systems. Covering 70 MHz to 6 GHz with tunable channel bandwidths from under 200 kHz to 56 MHz, it integrates dual independent receivers, dual transmitters, 12-bit ADCs/DACs, fractional-N frequency synthesizers, and configurable digital filters — all in a single 10 mm × 10 mm 144-ball CSP_BGA package.

W25Q64JVSSIQ

W25Q64JVSSIQ

The W25Q64JVSSIQ is Winbond's 64Mbit (8MB) serial NOR Flash memory from the JV series, delivering high-speed code and data storage for embedded systems. It supports standard SPI, Dual SPI, Quad SPI, QPI (Quad Peripheral Interface), and DTR (Double Transfer Rate) — achieving up to 532 Mbit/s effective throughput in Quad SPI mode at 133 MHz. Organized as 8M × 8 bits with uniform 4KB sectors, it provides fine-grained erase flexibility for applications mixing firmware storage with parameter data. The device is rated for 100,000 program/erase cycles minimum per sector with 20+ years data retention, operates from a single 2.7V–3.6V supply, and is specified over the full -40°C to +85°C industrial temperature range. Packaged in a standard 8-SOIC (208 mil) footprint, it is the most widely adopted NOR Flash chip in the embedded industry — the default external flash on ESP32 modules, the go-to code storage for STM32 and FPGA designs, and a staple in IoT, industrial control, and consumer electronics.

LSM6DS3TR-C

LSM6DS3TR-C

The LSM6DS3TR-C is STMicroelectronics' system-in-package 6-axis inertial measurement unit (IMU), part of the iNEMO family. It integrates a high-performance 3D digital accelerometer (up to ±16g) and a 3D digital gyroscope (up to ±2000 dps) with an embedded temperature sensor, all in a compact LGA-14 package. Designed for entry-level to mid-tier smartphones, portable PC platforms, wearables, and IoT devices, it achieves 0.90 mA in combo high-performance mode while supporting always-on low-power features including a hardware pedometer, tilt detection, free-fall detection, and a programmable finite state machine (FSM) for custom gesture recognition. The 4 KB FIFO buffer decouples sensor sampling from host MCU reads, and dual I²C/SPI interfaces with separate Vdd_IO ensure compatibility across 1.8V and 3.3V logic systems. Widely adopted in the Arduino/maker ecosystem (Adafruit, Arduino Nano 33 IoT, Seeed XIAO nRF52), the LSM6DS3TR-C is the recommended successor to the original LSM6DS3TR with improved power efficiency and noise performance.

LIS3DHTR

LIS3DHTR

The LIS3DHTR from STMicroelectronics is an ultra-low-power, high-performance three-axis linear MEMS accelerometer belonging to the "nano" family. With a user-selectable full scale of ±2g, ±4g, ±8g, or ±16g and 16-bit digital output, it delivers precision motion sensing across a wide dynamic range while consuming as little as 2µA in low-power mode. The device provides both I²C and SPI digital interfaces with an embedded 32-level FIFO buffer, a temperature sensor, and advanced motion-detection features — including free-fall, wake-up, 6D/4D orientation, and single/double-click recognition — enabling sophisticated motion processing without waking the host MCU. Packaged in a tiny 3mm × 3mm × 1mm 16-LGA footprint, it is optimized for battery-powered IoT devices, wearables, gaming controllers, and mobile handsets.

REF200AU

REF200AU

The REF200AU from Texas Instruments is a monolithic precision analog IC that integrates three fundamental building blocks — two independent 100µA current sources and a 1:1 current mirror — onto a single die in an 8-SOIC package. Its defining feature is a completely floating architecture: the device requires no power supply pins, no ground connection, and no external biasing. It operates entirely from the voltage present across its output terminals (2.5V to 40V), making it uniquely suited for two-wire sensor excitation, 4–20mA industrial current-loop transmitters, precision analog biasing, medical instrumentation, and semiconductor test equipment. FET-cascoded output stages deliver high output impedance for stable regulation under varying load conditions, with factory-laser-trimmed ±0.5% initial accuracy and ±25 ppm/°C temperature drift.

TPS82130SILR

TPS82130SILR

The TPS82130SILR is a 3A step-down DC-DC converter MicroSiP module from Texas Instruments that integrates the buck converter IC, power inductor, and compensation network into a single 3.0mm x 2.8mm x 1.5mm package. With 3V to 17V input, 0.9V to 6V adjustable output, 2.5MHz fixed switching frequency, and ultra-low 1.7uA quiescent current, it delivers complete power solutions under 40mm^2 total PCB area. DCS-Control provides fast transient response with seamless PWM-to-PFM transition for high efficiency from full load to standby. Ideal for IoT sensors, wearables, industrial modules, and any space-constrained design where discrete buck converters consume too much board real estate.

ISL99390FRZ-TR5935

ISL99390FRZ-TR5935

The ISL99390FRZ-TR5935 is a Gen2 Smart Power Stage (SPS) DrMOS module from Renesas Electronics, delivering 90A continuous output current per phase. It integrates the high-side driver, low-side driver, and MOSFETs into a single compact PQFN package, with added SMBus/PMBus 1.3 digital telemetry providing real-time current and temperature monitoring. Designed for multi-phase buck converters paired with Renesas ISL68/69xxx digital multiphase controllers, it powers server Vcore rails, GPU VRMs, telecom DC-DC converters, and high-current FPGA/ASIC point-of-load applications — enabling scalable, high-efficiency power delivery from 90A to 900A+ with minimal BOM and PCB footprint.

ICM-42688-P

ICM-42688-P

The ICM-42688-P is TDK InvenSense's flagship 6-axis MEMS IMU, combining a best-in-class 3-axis gyroscope with an ultra-low-noise 3-axis accelerometer in a compact 2.5x3.0x0.91mm LGA-14 package. With a gyroscope Angle Random Walk (ARW) of just 2.8 mdps/rtHz and accelerometer noise density of 70 ug/rtHz, it achieves navigation-grade precision at consumer price points. The 16-bit ADC, selectable gyro ranges up to 2000 dps, SPI up to 24 MHz (and I3C/I2C), 2KB FIFO, and 0.88mA low-noise power consumption make it the go-to IMU for drones, robotics, AR/VR, gimbal stabilization, and high-accuracy industrial motion sensing.