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From 4-layer GNSS tracker boards to 12-layer ADAS camera HDI stacks, Superb Automation fabricates PCBs for telematics, vehicle electronics, and industrial IoT. Our PCB capabilities cover the full range: Rogers RF laminates for GPS/cellular front-ends
Superb Automation provides medical-grade PCBA assembly under ISO 13485 quality management with IPC-A-610 Class 3 acceptance criteria. Medical electronics demand a combination of attributes not found together in other industries: sub-microvolt analog
Superb Automation manufactures medical-grade PCBA for Bluetooth-enabled blood glucose meters — compact, battery-powered diagnostic devices that combine precision analog measurement with BLE wireless connectivity. The assembly integrates a high-resolu
RoHS-compliant lead-free HASL standard. ENIG per IPC-4552 for fine-pitch. Immersion Ag, Sn, OSP also available.
40 inspection stations. Visual check under magnification, dimensional verification, vacuum-sealed packaging. Ready to ship.
IPC-A-600 defines visual acceptance criteria for bare PCBs. Class 2 for industrial/commercial, Class 3 for aerospace, medical & military.
IPC-6012 defines qualification and performance requirements for rigid PCBs: plating, etching, solder mask, tolerances.
Industry-standard test methods per IPC-TM-650: thermal stress, solderability, ionic contamination, microsection, peel strength, impedance.
IPC-4101 governs laminate and prepreg properties. Materials from Isola, Rogers, Taconic, Shengyi verified to IPC-4101 slash sheets.
288C solder float test per IPC-TM-650 verifies PCB resistance to assembly thermal shock. Pass/fail: no delamination or hole wall separation.
Solderability test per IPC-J-STD-003 verifies surface finish wetting. Ensures perfect solder acceptance at your assembly line. Tests every finish type.
ROSE testing per IPC-TM-650 2.3.25 measures residual ionic contamination. Ensures long-term reliability against corrosion and electrochemical migration.
40 inspection stations. Magnified visual check, dimensional verification, vacuum packaging. Every board to IPC-A-600 before shipment.
Atotech ENIG line. Electroless Nickel Immersion Gold - flat solderable finish for fine-pitch BGA, wire bonding & press-fit. Thickness verified by XRF on every panel.
At Superb Automation, we don't treat quality control as a checkbox at the end of the production line. It is built into every stage — from the moment solder paste touches a bare board, to the final visual check before the finished assembly goes into i
IPC-9701 defines thermal cycling test methods for evaluating solder joint reliability. Superb uses IPC-9701 as the reference for thermal stress testing — -40°C to +125°C cycling, in-situ electrical monitoring, and post-cycle failure analysis.
IPC-7525 defines solder paste stencil design — aperture shape, aspect ratio, area ratio, and thickness. The stencil is the single most important factor in solder paste printing quality. Superb's stencil designs follow IPC-7525 for reliable paste rele
IPC-7711/7721 defines correct procedures for rework and repair of PCBA assemblies. Superb's rework technicians follow these standards for component replacement, BGA reballing, trace repair, and conformal coating removal — fixing defects without creat
IPC-7095 governs BGA design, placement, reflow profiling, void criteria, and X-ray inspection. Superb Automation achieves sub-5% BGA void rates — well below the IPC Class 3 requirement of under 30%.
IPC-CC-830 defines qualification requirements for conformal coating materials — dielectric strength, moisture resistance, thermal endurance, flexibility. Superb uses IPC-CC-830 qualified coatings from HumiSeal and Electrolube for reliable environment