Tag: Build-to-Print

Superb Automation provides medical-grade PCBA assembly under ISO 13485 quality management with IPC-A-610 Class 3 acceptance criteria. Medical electronics demand a combination of attributes not found together in other industries: sub-microvolt analog

Superb Automation manufactures medical-grade PCBA for Bluetooth-enabled blood glucose meters — compact, battery-powered diagnostic devices that combine precision analog measurement with BLE wireless connectivity. The assembly integrates a high-resolu

AMP090950-60P · 9.0–9.5 GHz · Pulsed · WR90 Waveguide · Military-Grade,The standard model also accepts design proposals, production, and testing. · Superb Automation,

2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board

Panasonic MEGTRON6 R-5775 is a high-speed, low-loss multilayer laminate designed for next-generation RF and high-frequency digital applications. With a dielectric constant (Dk) of approximately 3.5 and a dissipation factor (Df) of 0.004 at 1 GHz, R-5

The traditional electronics supply chain fragments production across three or more vendors — a PCB fabricator, a component distributor, and an assembly house — each with their own lead times, quality standards, and communication channels. A quality i

The traction inverter is the single most power-dense electronic assembly in an electric vehicle. It converts DC battery voltage to three-phase AC to drive the motor — switching hundreds of amps at hundreds of volts, tens of thousands of times per sec

Advanced HDI (High-Density Interconnect) extends beyond standard multi-layer PCB fabrication by incorporating laser-drilled micro-vias, sequential lamination build-up layers, and fine-line trace/space geometries below 4/4 mil. Where a standard throug

10-layer high-precision multilayer main control PCB: 1.60mm, 4/4 mil, ENIG, high-density BGA. Build-to-print from Gerber files. Full DFM, symmetrical lamination. RFQ

2.60 mm Thick · 4/5 mil Trace/Space · ENIG · 0.19 mm Micro-Via · Case Study: 10G Optical Fiber Transmission Board