01
Incoming Inspection
PCB & component verification - visual, date code, packaging integrity check
PCBA Production Process
02
Solder Paste Printing
Laser-cut stencil + automatic printer - precise paste deposition on every pad
03
3D SPI Inspection
3D solder paste inspection - verifies volume, height & area before placement
04
SMT Pick & Place
High-speed chip shooter + multi-function placer - 0201 to 55mm BGA
05
Reflow Soldering
10-zone oven with nitrogen option - SAC305 lead-free as standard
06
3D AOI - Post Reflow
3D automated optical inspection - every visible solder joint checked
07
3D X-Ray - BGA & QFN
CT X-ray for hidden joints - voiding analysis & head-in-pillow detection
08
Through-Hole Insertion
Manual & automated DIP insertion - connectors, transformers, relays
09
Wave / Selective Soldering
Wave for through-hole boards - selective soldering for mixed-technology
10
Post-Solder AOI
Final optical inspection after all soldering processes
11
ICT - In-Circuit Test
Bed-of-nails or flying probe - verifies component values & connections
12
FCT - Functional Test
System-level test under operating conditions - custom fixtures & programs
13
Conformal Coating
Acrylic / silicone / urethane coating for moisture, dust & chemical protection
14
Box Build Assembly
Enclosure assembly, cable routing, display mounting, thermal management
15
IC Programming
Firmware flashing & configuration via JTAG, SWD, UART or USB
16
Final Inspection & Labeling
Visual check, serial number scanning, custom labeling & branding
17
Packaging & Shipping
Anti-static packaging, custom retail boxes, multi-pack carton - ready to ship
PCBA workshop resources
PCBA Manufacturing Equipment
High-Speed Chip Shooter — SM471/481PLUS
SM471/481PLUS high-speed chip shooter. Speed: 40,000 CPH. Minimum part size: 01005 (0.4mm × 0.2mm). PCB capacity: 400mm × 330mm. 7 production lines running in parallel.
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3D SPI — Solder Paste Inspection — S8080
S8080 3D Solder Paste Inspection (SPI). Measures volume, height, and area on every pad before component placement. Catches printing defects early — the cheapest fix in the entire S
Automatic Stencil Printer — Classic1008
Maximum printing area 400mm × 340mm. Laser-cut stencil with precise solder paste deposition on every pad — the most critical step in SMT. Poor printing cannot be fixed downstream.
AOI Testing Machine for DIP Board
AOI testing machine for DIP board. Automated optical inspection after wave soldering. Verifies solder hole fill, bridging, insufficient solder & component presence on through-hole
Smart X-Ray Component Counter
Smart X-ray component counter. Automated non-contact counting of SMT reels, trays & tubes in seconds. No more manual counting errors. Speeds up incoming inspection & stock-taking.
Automatic UV/IR PCB Curing Oven
Automatic UV/IR PCB infrared curing oven. Fast cure for UV-curable and thermally-cured conformal coatings. Reduces coating process from hours to minutes. High-throughput compatible
Selective Conformal Coating Machine
Selective conformal coating machine. Spray, brush & dip application of acrylic, silicone & urethane coatings. Protects against moisture, dust & corrosive atmospheres. Nordson ASYMT
Baking Machine — Components & PCBs
Baking machine for components and PCBs. 125°C moisture removal for MSL-sensitive parts & bare boards. Prevents delamination, measling & popcorning during reflow. J-STD-033 complian
Stencil Cleaning Machine
Clean machine for stencil. Automated removal of dried solder paste from fine-pitch apertures. Clean stencils = consistent paste release = higher first-pass yield.
ICT Testing Machine
ICT testing machine. In-circuit test verifies every electrical net — component values, shorts & opens. Bed-of-nails for volume production. Flying probe for prototypes. Keysight / T
Visual Automatic Board Cutter — RS-500
RS-500 visual automatic board cutter. Stress-free depaneling for V-scored & routed PCB panels. Optical alignment ensures clean cuts without cracking MLCC capacitors or stressing BG
PCBA Cleaning Machine
PCBA cleaning machine. Removes post-solder flux residue & ionic contamination. Essential for high-impedance circuits where leakage currents cause field failures. Aerospace, medical
LF Wave Soldering Machine — JT-450/350
JT-450/350 LF Wave Soldering Machine. Lead-free dual wave for reliable through-hole solder fill. Ideal for connectors, relays, transformers & high-power components.
X-Ray Machine — View-x1800
- View-x1800 X-Ray machine. Hidden BGA, QFN & LGA joint inspection. Voiding analysis, head-in-pillow detection & solder ball verification. IPC-7095 compliant.
SMT First Article Inspection — JCX-830
JCX-830 SMT first article inspection system. Compares assembled board against CAD — verifies every component value, polarity, orientation & placement. Catches BOM errors before the
AOI Machine — Post-Reflow Inspection
On/off AOI machine. Automated optical inspection after every reflow cycle. Multi-angle lighting catches 50+ defect types — bridges, insufficient solder, tombstoning, lifted leads,
12 Zone Lead-Free Reflow Oven — TEA-1200-DH
TEA-1200-DH 12 Zone Lead-Free Reflow Oven. Nitrogen atmosphere option. SAC305 (Sn96.5/Ag3.0/Cu0.5) lead-free standard. Precise thermal profiling ensures consistent joint quality fo
Quality Control & Testing
Inside Superb Automation's PCBA Quality Control Lab: The 10-Station Inspection Line That Ships Zero Defects
At Superb Automation, we don't treat quality control as a checkbox at the end of the production line. It is built into every stage — from the moment solder paste touches a bare boa
S10 — Visual Final Inspection: Last Line of Defense
Visual final inspection is the last QC checkpoint before shipment. Magnified visual check, dimensional measurement, serial number scanning, labeling, and anti-static packaging per
S9 — Ionic Contamination Test: ROSE Testing Explained
Ionic contamination testing per IPC-TM-650 measures residual flux and ionic contamination on PCBA surfaces. Prevents dendritic growth and leakage currents. Essential for high-imped
S7 — Thermal Stress Test: Solder Joint Reliability
Thermal stress testing validates solder joint reliability under temperature cycling from -40°C to +125°C, 500+ cycles. IPC-9701 compliant. Essential for automotive, aerospace, and
Conformal Coating Inspection — Verifying Protection Coverage
Conformal coating inspection uses UV light and thickness measurement to verify complete coverage, detect pinholes and bubbles, and confirm uniform thickness per IPC-CC-830. Critica
FCT — Functional Test: Simulating Real-World Operation Before Shipping
FCT simulates real operating conditions — power-up, signal input, load, and communication — to verify the assembled PCB performs its intended function. Every board shipped by Super
Flying Probe ICT — Fixtureless Electrical Testing for Prototypes and Small Batches
Flying Probe ICT uses motorized high-precision probes to verify every component value, diode polarity, and net continuity — no custom test fixture required. Ideal for prototypes, N
PCBA Factory Tour
Step inside our 5,000sqm SMT cleanroom - 7 lines, 15 million placements per day.
Warehouse & Logistics — Material Management and Shipping
Superb Automation's material management system covers incoming QC inspection, MSL-controlled component storage, batch traceability, ESD-safe handling, and professional packaging. Y
Facility & Environment — ESD Control, Cleanroom, and Climate Management
Superb Automation's PCBA workshop operates under ESD S20.20 protocols with conductive flooring, temperature 22±3°C, humidity 45-65% RH, and ISO 8 cleanroom conditions in SMT areas.
QC Laboratory — 10-Station Inspection & Testing Pipeline
Tour Superb Automation's QC laboratory — a 10-station inspection pipeline covering 3D AOI, X-ray CT, Flying Probe ICT, FCT, thermal stress, ionic contamination, and visual final in
Factory Tour — Inside Superb Automation's PCBA Workshop
Take a virtual walkthrough of Superb Automation's PCBA workshop — from SMT production line and QC laboratory to ESD-controlled facility and logistics center. See where your boards
SMT Production Line — From Bare PCB to Soldered Assembly
Walk through Superb Automation's SMT production line — 18 machines from solder paste printing to DIP soldering. See the equipment, process flow, and quality checkpoints that turn b
Quality Standards We Follow
Every board is manufactured and inspected to these industry standards - no exceptions.
IPC-9701 — Solder Joint Reliability Thermal Cycling Test
IPC-9701 defines thermal cycling test methods for evaluating solder joint reliability. Superb uses IPC-9701 as the reference for thermal stress testing — -40°C to +125°C cycling, i
IPC-7525 — Stencil Design Guidelines
IPC-7525 defines solder paste stencil design — aperture shape, aspect ratio, area ratio, and thickness. The stencil is the single most important factor in solder paste printing qua
IPC-7711/7721 — Rework, Modification and Repair of Electronic Assemblies
IPC-7711/7721 defines correct procedures for rework and repair of PCBA assemblies. Superb's rework technicians follow these standards for component replacement, BGA reballing, trac
J-STD-020 / J-STD-033 — Moisture Sensitivity Level (MSL) Classification & Handling
J-STD-020 classifies component moisture sensitivity; J-STD-033 specifies handling and baking procedures. Superb's dry cabinet storage and MSL tracking system ensure every moisture-
IPC-7095 — Design and Assembly Process Implementation for BGAs
IPC-7095 governs BGA design, placement, reflow profiling, void criteria, and X-ray inspection. Superb Automation achieves sub-5% BGA void rates — well below the IPC Class 3 require
IPC-CC-830 — Conformal Coating Material Qualification
IPC-CC-830 defines qualification requirements for conformal coating materials — dielectric strength, moisture resistance, thermal endurance, flexibility. Superb uses IPC-CC-830 qua
ESD S20.20 — Electrostatic Discharge Protection
Superb Automation's PCBA workshop implements ESD protection per ANSI/ESD S20.20 — conductive flooring, continuous wrist strap monitoring, ionization, and ESD-safe material handling
Nitrogen Reflow Soldering — Inert Atmosphere for Higher Reliability
Superb Automation uses nitrogen (N₂) atmosphere reflow soldering with oxygen levels below 500 ppm. Nitrogen reflow improves wetting, reduces solder balls and oxidation, and produce