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SUPERB provides advanced multilayer high-speed IC package substrate PCB solutions for 5G RF antenna modules, main-frequency power modules and high-frequency processor IC packaging. Featuring multi-layer, multi-step any-layer interconnection technolog
The layer stack-up defines the electrical and mechanical architecture of your PCB. It determines impedance, crosstalk, EMI performance, and board warpage — before a single component is placed. A well-planned stack-up makes challenging designs straigh
High-speed digital PCBs are a primary manufacturing focus at Superb Automation. We process ultra-low-loss laminates — Panasonic Megtron 6/7, Isola Tachyon 100G, and Nelco N4000-13 EP — with in-house back-drilling, precision differential impedance con
RF Transceiver Board PCBA. RF PCBA, Power Amplifier, LNA, RF Front-End, Phased Array, Beamforming, Antenna Array, Frequency Synthesizer, Rogers PCB
Data Center Expansion: Driving Demand for High-Layer-Count PCBsHow hyperscale cloud growth, AI training clusters, and 400G/800G networking are transforming PCB requirements.Hyperscale Data Centers: The Engine of PCB GrowthGlobal data center capital e
AI Hardware Growth: The PCB and PCBA Supply Chain ImpactHow the AI boom is reshaping demand for high-layer-count PCBs, advanced packaging, and high-speed assembly.AI Hardware: Unprecedented PCB DemandThe AI revolution, led by large language models an
High-speed digital PCB with 18 layers on Panasonic M6 (R-5775) laminate. 4.0 mm finished thickness, 0.20 mm minimum drill at 20:1 aspect ratio. Double-sided back-drilling with stub < 0.08 mm. Differential impedance control ±7.5% (≤ 50 Ω) and ±5% (> 5
Panasonic MEGTRON6 R-5775 is a high-speed, low-loss multilayer laminate designed for next-generation RF and high-frequency digital applications. With a dielectric constant (Dk) of approximately 3.5 and a dissipation factor (Df) of 0.004 at 1 GHz, R-5
High-performance PCB assembly for artificial intelligence and HPC workloads — GPU accelerators, AI server motherboards, switch backplanes, OAM/SXM modules, and chiplet interconnect substrates. 20–78 layer boards with Megtron 6 / IT-968G low-loss mate