Tag: Fine-Line

High-Density Interconnect (HDI) PCBs use laser-drilled micro-vias — as small as 0.05 mm — to connect layers at far higher density than conventional through-hole vias. Superb Automation manufactures HDI boards up to 30-layer ELIC (Every Layer Intercon

Rigid-flex PCBs combine rigid FR-4 sections with flexible polyimide layers in a single integrated assembly — eliminating connectors and cables between boards, reducing assembly weight, and removing failure points. Superb Automation manufactures rigid

Superb Automation operates PCB manufacturing facilities in Wuxi and Huizhou, supporting high-mix, high-complexity PCB production from prototype to volume. Combined monthly capacity exceeds 2.05 million sq.ft. (850K Wuxi + 1,200K Huizhou), expanding t

xinuo LDI Automatic exposure machine S100807 (2台) for fine-line exposure. 2/2 mil trace/space. Laser direct writing eliminates film errors.

LDI fine-line exposure down to 2/2 mil trace/space. Synova S100807 (2 units) utilizing UV laser direct writing. Eliminates phototool for HDI precision with zero film alignment errors.

PCB Fine-Line Imaging: LDI vs Traditional Exposure TechnologyHow laser direct imaging and traditional photolithography compare — and when to use each for your PCB design.The Challenge of Fine-Line PCB ImagingAs PCB designs shrink and component densit

2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board

Advanced HDI (High-Density Interconnect) extends beyond standard multi-layer PCB fabrication by incorporating laser-drilled micro-vias, sequential lamination build-up layers, and fine-line trace/space geometries below 4/4 mil. Where a standard throug