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High-Density Interconnect (HDI) PCBs use laser-drilled micro-vias — as small as 0.05 mm — to connect layers at far higher density than conventional through-hole vias. Superb Automation manufactures HDI boards up to 30-layer ELIC (Every Layer Intercon
20 Mitsubishi laser drills for micro-via processing. Hole sizes to 0.1mm. Dedicated HDI production bay for smartphones and ADAS boards.
20 Mitsubishi laser drills (5Z00U & ML605GTW5) for micro-via processing. Hole sizes down to 0.1mm for any-layer HDI. High-volume throughput for smartphones, ADAS, and 5G base stations.
PCB Drilling Guide: Mechanical, Laser, and Back-Drill TechnologyEverything you need to know about PCB drilling — from CNC mechanical drills to advanced laser micro-via and back-drill techniques.Why Drilling Defines PCB QualityDrilling is one of the m
Advanced HDI (High-Density Interconnect) extends beyond standard multi-layer PCB fabrication by incorporating laser-drilled micro-vias, sequential lamination build-up layers, and fine-line trace/space geometries below 4/4 mil. Where a standard throug
2.60 mm Thick · 4/5 mil Trace/Space · ENIG · 0.19 mm Micro-Via · Case Study: 10G Optical Fiber Transmission Board
High-Density Interconnect (HDI) PCB technology uses laser-drilled micro-vias — typically 0.1–0.15 mm in diameter — to connect layers at far higher density than traditional through-hole vias. Originally developed for smartphone miniaturization, HDI is