Tag: LDI

Prevention begins with controlling the quality of raw materials. Implement a rigorous incoming inspection for all PCBs and components. For PCBs, use a solderability test, such as the wetting balance test or a simple solder dip test, on coupon samples

Building on the critical foundation of moisture sensitivity management, thermal stress testing for PCBAs is a fundamental reliability validation process that simulates the mechanical and material stresses induced by solder reflow and operational temp

Shielding coatings are applied to PCBA surfaces to suppress electromagnetic interference (EMI) and radio frequency interference (RFI), preventing noise from disrupting sensitive circuits or causing emissions that exceed regulatory limits.

xinuo LDI Automatic exposure machine S100807 (2台) for fine-line exposure. 2/2 mil trace/space. Laser direct writing eliminates film errors.

LDI fine-line exposure down to 2/2 mil trace/space. Synova S100807 (2 units) utilizing UV laser direct writing. Eliminates phototool for HDI precision with zero film alignment errors.

You cannot see a good solder joint from the outside. You can see the fillet, you can see the shine, you can see whether the part is sitting flat. But what is happening inside the barrel of a through-hole, under the pad of a BGA, or at the interface w

Superb-TechBlogServicesContactHF System Board PCB Design: Multi-Board Grounding, Shielding, and EMI Control at HF Frequencies📅 June 21, 2026⏱ 578 wordsRF & MicrowaveHF System Board📑 Table of ContentsDesign OverviewTechnical Deep-DiveConclusionDesign

PCB Fine-Line Imaging: LDI vs Traditional Exposure TechnologyHow laser direct imaging and traditional photolithography compare — and when to use each for your PCB design.The Challenge of Fine-Line PCB ImagingAs PCB designs shrink and component densit

FPV video transmitters (VTX) are the critical RF link between the drone and the pilot's goggles or ground station. Superb Automation provides PCBA assembly for VTX modules across all common FPV frequency bands — from the popular 5.8 GHz band (up to 8

2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board

10-layer high-precision multilayer main control PCB: 1.60mm, 4/4 mil, ENIG, high-density BGA. Build-to-print from Gerber files. Full DFM, symmetrical lamination. RFQ

2.60 mm Thick · 4/5 mil Trace/Space · ENIG · 0.19 mm Micro-Via · Case Study: 10G Optical Fiber Transmission Board