Tag: IC Package Substrate PCB

Memory IC Package Substrate PCB SolutionProduct OverviewSUPERB provides advanced Memory IC Package Substrate PCB solutions for UDPQFN and memory wafer packaging applications.The product series adopts conventional die bonding technology with gold wire

Product OverviewSUPERB provides advanced multilayer BGA IC package substrate PCB solutions for CPU packaging, power module processor packaging, and main control IC packaging applications.Based on IC packaging-grade BT material, advanced die attach bo

SUPERB provides advanced multilayer high-speed IC package substrate PCB solutions for 5G RF antenna modules, main-frequency power modules and high-frequency processor IC packaging. Featuring multi-layer, multi-step any-layer interconnection technolog

Advanced Multi-Layer BGA Package Substrate for CPU, Power Module and Processor IC Applications. With the rapid development of semiconductor technology, traditional PCB solutions cannot meet the requirements of high-density chip packaging. IC Package