Where Layers Become a Solid Board
A multilayer PCB is a sandwich: etched inner-layer cores, prepreg sheets (partially cured fiberglass-epoxy), and copper foil. The lamination press fuses them into one solid board under precisely controlled heat and pressure. Prepreg resin melts, flows into every gap between copper features, then crosslinks into a rigid permanent bond. At Superb, our CEDATE (Italy) and HuoQuan vacuum presses handle stack-ups up to 68 layers - the domain of aerospace backplanes, supercomputer motherboards, and military electronics.
Why Vacuum Lamination Matters
Vacuum lamination evacuates air from the press cavity before and during the heat cycle. Without vacuum, entrapped air bubbles create voids between layers - invisible after pressing but catastrophic during reflow when expanding gas delaminates the board. Vacuum ensures complete resin fill and void-free bonding across the entire panel area. For boards above 20 layers, vacuum lamination is the only way to achieve reliable interlayer bonding.
The Lamination Cycle
| Phase | Temperature | Pressure | Duration |
|---|---|---|---|
| Preheat | 25C to 175C | ramping | 20-30 min |
| Cure | 175-190C | 250-350 PSI | 60-120 min |
| Cooling | 190C to 50C | maintained | 30-40 min |
Total cycle: 90-180 minutes depending on layer count. Cooling under pressure prevents warpage. The finished panel exits flat, solid, and ready for drilling.
