Tag: delamination

Non-destructive X-ray inspection for internal PCB defects - voids, delamination, drill registration. Sub-micron precision for multilayer verification.

288C solder float test per IPC-TM-650 verifies PCB resistance to assembly thermal shock. Pass/fail: no delamination or hole wall separation.

Baking machine for components and PCBs. 125°C moisture removal for MSL-sensitive parts & bare boards. Prevents delamination, measling & popcorning during reflow. J-STD-033 compliant.