Surface Finish - ENIG Line
Atotech ENIG line. Electroless Nickel Immersion Gold - flat solderable finish for fine-pitch BGA, wire bonding. XRF verified.
Tag: Atotech
DES Line
DES acid etching line GL231108B1027A (1 unit). 3 dedicated lines for Develop-Etch-Strip with real-time process monitoring.
Electroless Copper Line
Universe copper deposition pretreatment line GL231108B1032A + Atotech electroless copper. Chemical copper deposition creates conductive base for electrolytic plating.
Panel Plating Line
Dongwei vertical continuous plating line (8 copper) + Atotech/Schmid. Electrolytic copper plating to target thickness with heavy copper support for power electronics.
ENIG Line
Atotech ENIG line. Electroless Nickel Immersion Gold - flat solderable finish for fine-pitch BGA, wire bonding & press-fit. Thickness verified by XRF on every panel.