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As 1.6T optical modules move from sampling to volume production, PCB technology has quietly become one of the biggest bottlenecks in the supply chain. The modified semi-additive process (mSAP), once a niche technique for high-end smartphones, is now
Advanced HDI (High-Density Interconnect) extends beyond standard multi-layer PCB fabrication by incorporating laser-drilled micro-vias, sequential lamination build-up layers, and fine-line trace/space geometries below 4/4 mil. Where a standard throug