Tag: fine-pitch

IPC-7525 defines solder paste stencil design — aperture shape, aspect ratio, area ratio, and thickness. The stencil is the single most important factor in solder paste printing quality. Superb's stencil designs follow IPC-7525 for reliable paste rele

Clean machine for stencil. Automated removal of dried solder paste from fine-pitch apertures. Clean stencils = consistent paste release = higher first-pass yield.

DECAN S2 multi-function placer. Speed: 96,000 CPH. Min part: 01005. Max part: 42mm. PCB size: 1200mm × 460mm. Handles BGA, QFN, QFP, connectors & odd-form parts with precision.