Microsection Analysis
Cross-section analysis with Olympus microscope. Plating thickness, hole wall quality, inter-layer bonding. Destructive testing for process validation per IPC-6012.
Cross-section analysis with Olympus microscope. Plating thickness, hole wall quality, inter-layer bonding. Destructive testing for process validation per IPC-6012.
40 inspection stations for visual check, dimensional measurement, vacuum packaging. Every board examined per IPC-A-600 before shipment.