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Finished Board SpecificationsLayer Count (FR-4)1 – 20 layersHDI1–3阶 (mechanical blind or laser blind vias)Board Thickness0.6 – 3.2 mm (thickness varies with layer count)Thickness Tolerance (≥ 1.0 mm)±10%Thickness Tolerance (< 1.0 mm)±0.10 mmMax Board
Industry-standard test methods per IPC-TM-650: thermal stress, solderability, ionic contamination, microsection, peel strength, impedance.
Cross-section analysis with Olympus microscope. Plating thickness, hole wall quality, inter-layer bonding. Destructive testing for process validation per IPC-6012.
IPC-6012 defines qualification and acceptance criteria for rigid printed boards. Every incoming bare PCB at Superb Automation is verified against IPC-6012 before assembly — catching fabrication defects that solder cannot fix.
PCB Microsection Analysis and Failure Detection GuideHow cross-section analysis verifies PCB manufacturing quality and diagnoses failure mechanisms.What Is PCB Microsection Analysis?Microsection analysis — also called cross-sectioning or metallograph