10-Layer 2.60mm HD Multimedia Main Control PCB
2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board
2.60 mm Thick · 4/4 mil Trace/Space · 0.20mm Micro-Via at 12.8 Aspect Ratio · High-Coverage ENIG · Double-Sided High-Density BGA · Case Study: 10-Layer Multimedia Development Board
10-layer high-precision multilayer main control PCB: 1.60mm, 4/4 mil, ENIG, high-density BGA. Build-to-print from Gerber files. Full DFM, symmetrical lamination. RFQ
483.61 × 279.15 mm · 4/4 mil Trace/Space · ENIG · Full DFM Report · Case Study: dm6446-v3.0-0331-2
4-layer industrial control PCB: 4× DDR top/bottom, 167.64×111.15mm, 4/4 mil, ENIG. DFM verified, impedance controlled. Prototype to volume