PCB Design Capabilities
Over a decade of high-quality PCB design and one-stop engineering. From concept to production, we ensure DFM alignment and fast time-to-market.
High-speed multi-layer digital PCB
RF / microwave circuit boards
Low-level analog design
Ultra-low EMI for MRI
DDR2/3/4/5 memory layout
Printed antenna (BLE/Wi-Fi)
Assembly drawing & test data
Auto-routing for dense HDI
Remote communication
Industrial fuel transfer
Industrial process control
Medical devices
Aviation control equipment
Scientific multiprocessor
High-reliability computing
RF transmission / 5G
Circuit design & simulation
FPGA to ASIC conversion
Component engineering
Pulse circuits & SI/PI
Embedded processors: PowerPC, Intel x86, TI DSP, Broadcom
High-speed serial links (PCIe, Ethernet)
DDR memory interface
Packaging & industrial design
FEA / vibration simulation
Thermal simulation (CFD)
PCB-linked DFM/DFA & cost reduction
Design for Manufacturability (DFM) Review
Every PCB design that skips a DFM review risks delays, cost overruns, or boards that cannot be built. Superb Automation runs a mandatory DFM review on every Gerber package within 24 hours.
We verify trace/space minimums against your chosen copper weight — 1 oz, 2 oz, or heavy copper — and flag neck-down areas where routing constraints squeeze below spec. Differential pair spacing consistency is checked to the nearest 0.05 mm to maintain impedance integrity.
Aspect Ratio: <10:1 safe="">20:1 rejected
Annular Ring (Class 2): 0.05 mm min
Annular Ring (Class 3): 0.10 mm min
Blind/Buried Via: Stacked vs staggered reliability verified
Solder Mask Dam: ≥0.075 mm between fine-pitch pads
Pad-to-Mask Clearance: 0.05 mm per side
File version & latest revision timestamp
Process: Lead-free / leaded (RoHS)
Clear component silkscreen & reference designators
Reasonable stackup & panelization style
Correct Gerber / ODB++ & netlist provided
Comprehensive programming record & test plan
Clear assembly manual & schematic reference
Special process: controlled impedance, backdrill, ENIG
Testability & thermal component handling plan
DFM report with actionable recommendations
High-Speed PCB Design & Signal Integrity
As data rates push beyond 25 Gbps into 112 Gbps PAM4 territory, PCB design becomes an RF engineering discipline. Every millimeter of trace, every via transition matters.
| Signal Type | Target Impedance | Tolerance | Typical Application |
|---|---|---|---|
| Single-ended | 50 Ω | ±10% | RF traces, clock lines |
| Differential (standard) | 100 Ω | ±10% | LVDS, MIPI, USB 3.x |
| Differential (high-speed) | 85 Ω | ±8% | PCIe Gen 5/6, 112G SerDes |
| Differential (memory) | 90 Ω | ±10% | DDR4/DDR5 data, address |
At 28 GHz (112 Gbps Nyquist), standard FR-4 loses over 1.5 dB per inch. Our team models your channel's complete loss budget — trace loss, via stub loss, connector loss, and package loss — to ensure your design meets the receiver's minimum eye opening before layout begins.
HDI PCB Design
HDI enables smaller, lighter, and faster PCBs through microvias, fine lines, and advanced stack-up architectures. It is the standard for high-pin-count BGAs, mobile devices, and compact embedded systems.
| HDI Level | Via Structure | Layer Range | Best For |
|---|---|---|---|
| 1-N-1 | 1 microvia layer + through vias | 4–8 layers | Smartphone, IoT, wearables |
| 2-N-2 | 2 microvia layers (stacked or staggered) | 6–12 layers | ADAS cameras, medical implants |
| Any-Layer (ALIC) | All layers via laser microvias | 8–16+ layers | 5G baseband, AI accelerators |
| mSAP / SAP | Semi-additive, ≤15 μm L/S | Any | IC substrates, advanced packaging |
PCB Stack-Up & Material Selection
Material selection — Dk, Df, Tg, CTE — directly impacts signal integrity, thermal performance, and long-term reliability.
| Material | Dk @ 10 GHz | Df @ 10 GHz | Tg (°C) | Best For |
|---|---|---|---|---|
| Standard FR-4 | 4.2–4.5 | 0.020 | 130–140 | General digital,<1 ghz=""> |
| Mid-Tg FR-4 | 3.8–4.2 | 0.015 | 150–170 | Industrial, automotive |
| High-Tg FR-4 | 3.6–4.0 | 0.010 | 170–180 | Lead-free reflow, high-reliability |
| Rogers 4350B | 3.48 | 0.0037 | >280 | RF/microwave, mmWave |
| Megtron 6 / 7 | 3.4–3.6 | 0.002–0.004 | 185–200 | 25G–112G high-speed digital |
| Taconic / PTFE | 2.2–3.5 | 0.0009–0.002 | >280 | 77 GHz radar, satellite |
Complex RF-digital boards demand hybrid stack-ups. We engineer combinations of FR-4, Rogers, PTFE, and low-loss prepregs in the same board, managing CTE mismatch through symmetrical layering. Every hybrid stack-up undergoes thermal stress testing before production release.
PCB Manufacture Capability
Wuxi + Huizhou facilities — high-mix, high-complexity, quick-turn.
| Parameter | Value |
|---|---|
| Monthly Capacity | 2.85M+ sq. ft. |
| Max Layers | 128 (future 138) |
| Min Line Width / Spacing | 0.0125 / 0.0125 mm |
| Min Laser Drill | 0.05 mm |
| Parameter | Wuxi | Huizhou |
|---|---|---|
| Capacity (kSF/month) | 900 | 1,500 |
| Max Layers | 138 | 68 |
| Min Line Width/Spacing (mm) | 0.0125 / 0.0125 | 0.04 / 0.04 |
| Min Mechanical Drill (mm) | 0.075 | 0.075 |
| Board Thk – 2L min (mm) | 0.10 | 0.10 |
| Finish | Wuxi | Huizhou |
|---|---|---|
| OSP / ENIG / Selective ENIG | Yes | Yes |
| ENEPIG / Hard Gold / Soft Gold | Yes | Yes |
| Immersion Tin / Silver | Yes | Yes |
| HASL (Lead-free) | Outsourced | Outsourced |
| Capability | Wuxi | Huizhou |
|---|---|---|
| FR4 High-Tg / Halogen-free | Yes | Yes |
| BT Resin / High Speed materials | Yes | Yes |
| Polyimide / EMI Shielding | Yes | Yes |
| HDI / Rigid-Flex | Yes | Yes |
| Heavy Copper / Back Drill | Yes | Limited |
| Copper Inlay / High Thermal | Yes | Limited |
Embedded Development Services
Dedicated team of engineers averaging 15–33 years of experience. Full-cycle embedded projects encompassing hardware, software, qualification testing, and system integration.
System architecture and design, electronic circuit board design and analysis, real-time software design, graphical user interface and tool development, PCB layout, appearance design and packaging, plus full documentation delivery.
Embedded systems: ARM, RISC-V, x86 microprocessors
Pre-evaluation of EMI/EMC and environmental compliance
Control systems & real-time closed-loop algorithms
C/C++, Rust, Assembly development
Model-based design: MATLAB/Simulink
MCU expertise: NXP, Infineon, Intel, TI, Microchip, Renesas, STM32
RTOS: FreeRTOS, Zephyr, VxWorks, ThreadX; Linux: Yocto, Buildroot
Motor control: FOC, trapezoidal; sensor fusion; predictive diagnostics
Low-power design for battery-operated devices
Communication: CANopen, Modbus, EtherCAT, MQTT, BLE
Security: secure boot, encryption, TLS, secure OTA
Production test automation & NPI transition
Legacy system modernization & code migration
Embedded system architecture & specification
Hardware design (schematic, PCB, BOM)
Firmware & driver development
Middleware & application software
Manufacturing & NPI pilot runs
BOM management & strategic procurement
Production test fixtures & software tools
Instruction manuals & production packages
NPI trial production report & yield analysis
Design optimization for product lifecycle
Regulatory compliance: CE, FCC, UL
