Tag: microsection analysis

Cross-section analysis with Olympus microscope. Plating thickness, hole wall quality, inter-layer bonding. Destructive testing for process validation per IPC-6012.

IPC-6012 defines qualification and acceptance criteria for rigid printed boards. Every incoming bare PCB at Superb Automation is verified against IPC-6012 before assembly — catching fabrication defects that solder cannot fix.

PCB Microsection Analysis and Failure Detection GuideHow cross-section analysis verifies PCB manufacturing quality and diagnoses failure mechanisms.What Is PCB Microsection Analysis?Microsection analysis — also called cross-sectioning or metallograph